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Non-contact line sensor CLS. High precision, high speed, and wide range 3D shape measurement. High tolerance for angles suitable for edges and slopes. Numerous achievements in wafer edge measurement.

【Application】 Non-contact 3D shape measurement is possible. It is also possible to replace contact methods with non-contact methods. ■ Home Appliances (Smartphones) - LCD glass - OLED mask inspection - Fine scratches and other surface defects - Wire bonding - AR glasses ■ Semiconductor Manufacturing Process - Wafer edge shape measurement - Wafer edge defect inspection - Wafer dicing groove appearance inspection - BGA inspection - IC package and circuit inspection ■ Automotive - Valve inspection - Car interior - Glass inspection - Inspection of airbag welding beads

For high-precision thickness measurement of opaque materials, Enovasense's laser photo-thermal sensor can measure thickness from a minimum of 10nm, regardless of the material.

■Thickness measurement range 10nm~1mm ■Measurement accuracy 0.5~3% or less ■Beam spot diameter φ0.15mm or more ■Measurement mode Phase shift, amplitude ■Product lineup Multiple lineups available for probes (working distance, beam spot diameter) and lasers (wavelength, power)

An all-in-one scanner that can weld workpieces under optimal conditions through ultra-fast shape recognition.

Wavelength range: 1030 to 1080 nm Maximum output: 6kW (CW) Collimator: Fc = 100, 125, 150 mm Focus: Ff = 255, 340, 460 mm [Keywords: Applications, Measurement items, Benefits, etc.] Disk laser, fiber laser, YAG fundamental wave, Disk, Fiber, Scanner, remote welding, seam tracking, seam search, welding monitor, FocusFinder

It is possible to obtain the quality assessment results of the product simultaneously with the completion of laser welding. It is equipped with a user-friendly GUI that facilitates easy operations such as data linking, review, and analysis.

<Sensor> - Compact Sensor: Analog sensor for fundamental wave - Digital Sensor: Available for fundamental wave, as well as green and blue <Control Device Shapes> - LWM Standard: Full-size cabinet - LWM Compact: Mid-size case - LWM OEM: Mounting plate for 19-inch rack - LWM Base: Control equipment only (requires assembly) [Keywords for Applications, Measurement Items, Benefits, etc.] Disk laser, fiber laser, diode laser, green laser, blue laser, YAG, fundamental wave, second harmonic, third harmonic, Disk, Fiber, LD, LDD, fixed optical head, scanner, solid-state laser, scanner, time-sharing, 250kHz

A metal shaping head that reduces labor to the limit, allowing for the reduction of unnecessary costs and time! The processing speed is significantly faster, achieving stable shaping and processing!

【Other Features】 ■ The laser accurately hits only the necessary parts of the wire and workpiece... Reducing energy consumption ■ The shape is measured before and after buildup, and the wire feed speed is controlled to adjust the buildup height... Stabilization of generated shape → Even if the base material is uneven, the amount of buildup is adjusted to correct it... Automatic shape repair ■ The wire's bending tendency is eliminated, and the wire is supplied straight... Prevention of buildup shape bias ■ The laser output is adjusted according to the workpiece temperature for heat input control... Prevention of base material melting away *For more details, please download the PDF or contact us directly.

Area sensor for internal defect inspection after welding as a substitute for X-rays, with over 15,000 units of monitoring systems during welding in operation.

For details, please refer to the application materials. We will also be exhibiting at the Battery Expo (Makuhari Messe) to be held in October 2024.