We have revamped the catalog for the diamond grinding pad "SQUADRO"!

ピュアオンジャパン

We have renewed the catalog in conjunction with the product renewal of the diamond grinding pads "SQUADRO." If you wish, please download it from the catalog page for your use. 【Renewal Details】 *Applicable to SQUADRO-G2/M2/H2. ■ A new manufacturing process allows for quicker delivery times. ■ We can now provide pads in a single piece with outer diameters ranging from 200 to 1,200mm. * Sizes larger than this will be provided in multiple pieces that are bonded together. * We will manufacture to sizes tailored to customer specifications. 【Product Lineup】 SQUADRO-G2: A pad suitable for materials such as glass and lithium tantalate. SQUADRO-M / M2: Features a medium-hard bond that retains abrasive grains, making it suitable for precision grinding of metals, ceramics, and glass. SQUADRO-H / H2: Retains abrasive grains with a hard bond, making it suitable for precision grinding of hard materials and ceramics. SQUADRO-O / OWH: A pad specialized for precision grinding of optical materials. There is a relatively large abrasive grain size O, and sizes up to 1μm for OWH.

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Diamond grinding pad "SQUADRO-G2": A powerful method for removing free abrasive grains.
Detach and release! Can be attached to the existing device's base plate. A diamond grinding pad that enables high-quality processing of glass materials easily, cleanly, and efficiently.

【Product Specifications】 - Diameter: 200~1,200mm *Sizes larger than this will be provided in multiple pieces that are bonded together. *Manufactured to customer specifications. - Diamond sizes: 15μm/30μm/45μm/60μm - Thickness: 0.6mm - Bonding material: Resin bond - Carrier material: Polycarbonate - Back processing: Self-adhesive tape/Metal plate/Magnetic foil ■ SQUADRO is available in three types of bonding materials tailored to different applications. SQUADRO-M / M2: This medium-hard bond retains the abrasive grains and is suitable for precision grinding of metals, ceramics, and glass. SQUADRO-H / H2: This hard bond retains the abrasive grains and is suitable for precision grinding of hard materials and ceramics. SQUADRO-O / OWH: This pad is specialized for precision grinding of optical materials. There are larger abrasive grains available in size O and up to 1μm in OWH.
Diamond Grinding Pad 'SQUADRO-M2/H2'
De-bonding! Can be attached to the existing device's base plate. A diamond grinding pad that enables high-quality processing of various materials such as metal and ceramics easily, cleanly, and efficiently.

【Product Specifications】 - Diameter: 200~1,200mm *Sizes larger than this will be provided in multiple pieces that are bonded together. *We will manufacture to the size specified by the customer. - Diamond sizes: 3μm/6μm/15μm/30μm/60μm/(H only: 125μm) - Thickness: 0.6mm - Bonding materials: SQUADRO-M2: Resin bond / Medium hardness SQUDARO-H2: Resin bond / Hard - Carrier material: Polycarbonate - Back processing: Self-adhesive tape / Metal plate / Magnetic foil ■ SQUADRO is offered with three types of bonding materials based on application. SQUADRO-M / M2: A medium hardness bond that retains abrasive grains, suitable for precision grinding of metals, ceramics, and glass. SQUDARO-H / H2: A hard bond that retains abrasive grains, suitable for precision grinding of hard materials and ceramics. SQUADRO-O / OWH: A pad specialized for precision grinding of optical materials. There are relatively large abrasive grains in O, and sizes up to 1μm in OWH.