We have renewed the catalog in conjunction with the product renewal of the diamond grinding pads "SQUADRO." If you wish, please download it from the catalog page for your use. 【Renewal Details】 *Applicable to SQUADRO-G2/M2/H2. ■ A new manufacturing process allows for quicker delivery times. ■ We can now provide pads in a single piece with outer diameters ranging from 200 to 1,200mm. * Sizes larger than this will be provided in multiple pieces that are bonded together. * We will manufacture to sizes tailored to customer specifications. 【Product Lineup】 SQUADRO-G2: A pad suitable for materials such as glass and lithium tantalate. SQUADRO-M / M2: Features a medium-hard bond that retains abrasive grains, making it suitable for precision grinding of metals, ceramics, and glass. SQUADRO-H / H2: Retains abrasive grains with a hard bond, making it suitable for precision grinding of hard materials and ceramics. SQUADRO-O / OWH: A pad specialized for precision grinding of optical materials. There is a relatively large abrasive grain size O, and sizes up to 1μm for OWH.

Diamond grinding pads are sheet-like grinding tools that secure diamond abrasives to metal plates or urethane pads. They are used by adhering them to the polishing plates currently in use. In recent years, they have gained attention as an alternative to free abrasives from the perspective of environmental impact and maintenance. In this experiment, we investigated the grinding rate and surface roughness on sapphire samples, which are difficult-to-grind materials. The results showed that both the 'PLATO' and 'SQUADRO' grinding pads were effective, with the PLATO-40 µm demonstrating a very high grinding rate. The possibility of achieving sapphire grinding with fixed grinding pads, a long-standing challenge in the industry, is now becoming clearer. If you are interested, please feel free to contact us through the inquiry form.

The diamond grinding pad "SQUADRO" is a sheet-like grinding tool that fixes diamond abrasives to a metal plate or urethane pad. It is used by attaching it to the polishing plate you are currently using. In recent years, it has gained attention as an alternative to free abrasives from the perspective of environmental impact and maintenance. This time, we used "SQUADRO-G" with particle sizes of 15μm, 30μm, and 45μm to process commonly used glass materials (blue plate glass, quartz glass, BK7 glass) and aluminum nitride, investigating the grinding rate and surface roughness Ra. ★ Summary of Results: Various Glass Materials Changing the particle size of SQUADRO-G from 15μm to 30μm significantly increases the processing rate. It is recommended to start with the 30μm size, which offers a good balance between rate and roughness. ★ Summary of Results: Aluminum Nitride The processing rate increases in proportion to the particle size of SQUADRO-G. It is recommended to start with the 30μm size, which offers a good balance between rate and roughness. If you are interested, please feel free to contact us through the inquiry form.

At Pureon, we are collaborating with major next-generation power semiconductor manufacturers in Europe and the United States to contribute to the development of EVs. In the following case book, we will introduce examples of slicing SiC ingots and wafer processing used in next-generation power semiconductors. If you are having trouble with processing SiC or GaN, please feel free to consult us. ★ Streamlining the slicing of SiC ingots using a multi-wire saw! https://premium.ipros.jp/pureon/catalog/detail/656418/?hub=165&categoryId=59887 ★ Reducing processing time for SiC wafers and minimizing defective products! https://premium.ipros.jp/pureon/catalog/detail/646885/?hub=165&categoryId=59887 Additionally, these products have been featured in the overseas semiconductor industry magazine "Compound Semiconductor." https://premium.ipros.jp/pureon/news/detail/95752/?hub=160