We have published examples of SiC wafer processing!

ピュアオンジャパン

At Pureon, we are collaborating with major next-generation power semiconductor manufacturers in Europe and the United States to contribute to the development of EVs. In the following case book, we will introduce examples of slicing SiC ingots and wafer processing used in next-generation power semiconductors. If you are having trouble with processing SiC or GaN, please feel free to consult us. ★ Streamlining the slicing of SiC ingots using a multi-wire saw! https://premium.ipros.jp/pureon/catalog/detail/656418/?hub=165&categoryId=59887 ★ Reducing processing time for SiC wafers and minimizing defective products! https://premium.ipros.jp/pureon/catalog/detail/646885/?hub=165&categoryId=59887 Additionally, these products have been featured in the overseas semiconductor industry magazine "Compound Semiconductor." https://premium.ipros.jp/pureon/news/detail/95752/?hub=160

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Related product information

Diamond slurry for wire saw "WSG": Glycol-based
Glycol-based diamond slurry that improves cutting speed and achieves high reproducibility for multi-wire saws. Water-soluble, easy to clean, and environmentally friendly!

【Product Characteristics】 - Carrier liquid: Glycol - Typical application: Multi-wire saw - Density: 1.05 g/cm³ - Typical diamond type/abrasive size: MONO-ECO 3 – 6 micron - Typical diamond concentration: 250 cts/l
Metal composite material grinding pad "IRINO": Enhancing the performance of existing grinding machines.
Achieves high polishing rates and excellent surface finish on materials such as SiC and sapphire!

【Product Specifications】 - Thickness: 1mm - Bonding Material: Resin Bond - Carrier Material: Polycarbonate - Diameter: 200 to 1,200 mm *Sizes larger than this will be provided in multiple pieces that are bonded together. - Back Processing: Self-adhesive tape
Diamond grinding pad "PLATO": A grinding pad that can also cut sapphire.
Metal bond grinding pads with high grindability, long lifespan, and compatibility with almost all cooling lubricants (coolants).

The diamond grinding pad PLATO is recommended for grinding materials such as ceramics, glass, and various metals. It maintains a high grinding rate due to diamond abrasives fixed with a metal bond. PLATO is highly praised for its excellent grindability and long lifespan. Because it is metal bond type, it is compatible with almost all cooling lubricants (coolants). 【Examples of PLATO processing are now available】 We have created a document summarizing examples of processing using PLATO for sapphire, white alumina, and sample polishing. For more details, please refer to the catalog at the bottom of the page! *The diamond grinding pad is a plate-shaped grinding tool that fixes diamond abrasives to a metal plate or urethane pad. It is used by attaching it to the polishing plate you are currently using. In recent years, it has gained attention as an alternative to free abrasives from the perspective of environmental impact and maintenance. In addition to the metal bond type PLATO, Pureon also offers the resin bond type SQUADRO in its lineup.