Diamond slurry for wire saw "WSG": Glycol-based
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Glycol-based diamond slurry that improves cutting speed and achieves high reproducibility for multi-wire saws. Water-soluble, easy to clean, and environmentally friendly!
WSG is a glycol-based diamond slurry suitable for high-performance multi-wire saws. It can be used immediately upon arrival. Our unique additives promote adhesion between the slurry and the wire, enhancing cutting speed. 【Features】 ■ Tailor-made specifications You can freely choose the type of diamond, particle size, and concentration. ■ High polishing rate It has optimal adhesion to the wire, maintaining a high polishing rate. ■ High reproducibility Thanks to our unique formulation, no dispersion processing is required. ■ Water-soluble, environmentally friendly, and easy to maintain *For more details, please feel free to contact us.
basic information
【Product Characteristics】 - Carrier liquid: Glycol - Typical application: Multi-wire saw - Density: 1.05 g/cm³ - Typical diamond type/abrasive size: MONO-ECO 3 – 6 micron - Typical diamond concentration: 250 cts/l
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Multi-wire saw for slicing SiC ingots
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We have published examples of SiC wafer processing!
At Pureon, we are collaborating with major next-generation power semiconductor manufacturers in Europe and the United States to contribute to the development of EVs. In the following case book, we will introduce examples of slicing SiC ingots and wafer processing used in next-generation power semiconductors. If you are having trouble with processing SiC or GaN, please feel free to consult us. ★ Streamlining the slicing of SiC ingots using a multi-wire saw! https://premium.ipros.jp/pureon/catalog/detail/656418/?hub=165&categoryId=59887 ★ Reducing processing time for SiC wafers and minimizing defective products! https://premium.ipros.jp/pureon/catalog/detail/646885/?hub=165&categoryId=59887 Additionally, these products have been featured in the overseas semiconductor industry magazine "Compound Semiconductor." https://premium.ipros.jp/pureon/news/detail/95752/?hub=160
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Our products for SiC have been featured in the magazine "Compound Semiconductor"!
Our products have been featured on the cover of the globally acclaimed magazine "Compound Semiconductor," which is widely read in the semiconductor industry. The article introduces products for the next-generation semiconductor "SiC (Silicon Carbide)," which is gaining attention for its high power and miniaturization in electronics, starting with electric vehicles. Although it's in English, please feel free to take a look: https://compoundsemiconductor.net/article/114825/The_Secret_Sauce_Of_Silicon_Carbide We also welcome inquiries regarding our products for SiC. Please feel free to contact us.
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Microdiamant, which has contributed to customers through precision classification, has acquired the American CMP-related company Eminess Technology and has become Pureon. In addition to our high-quality diamond-related products, we will also accumulate in-house know-how regarding final finishing CMP. What is important for our customers is the final finish. Even now, we receive inquiries about our diamond polishing because customers want to shorten the CMP process time. In the future, we will comprehensively handle consultations from grinding and polishing to CMP.