【用途】SiC

【用途】SiC
次世代パワー半導体としても注目のSiC向けにおすすめの製品です。
1~3 件を表示 / 全 3 件
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Metal composite material grinding pad "IRINO": Enhancing the performance of existing grinding machines.
Achieves high polishing rates and excellent surface finish on materials such as SiC and sapphire!
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Water-based diamond suspension "OPW": Slurry for optical materials
Slurry formulated with a formula that achieves excellent polishing results for various optical materials such as fluorite!
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Diamond slurry for wire saw "WSG": Glycol-based
Glycol-based diamond slurry that improves cutting speed and achieves high reproducibility for multi-wire saws. Water-soluble, easy to clean, and environmentally friendly!
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