At the SiC and GaN Processing Technology Exhibition 2025, you can see diamond grinding pads and metal composite pads at the Pure on Japan booth! 【Event Overview】 ■ Dates: March 5 (Wednesday) to March 7 (Friday), 2025, 10:00 AM to 5:00 PM ■ Venue: Makuhari Messe, Exhibition Hall 8 　　　(2-1 Nakase, Mihama-ku, Chiba City, Chiba Prefecture) ■ Admission Fee: Free (Pre-registration required) ■ Booth Number: S-16 【Exhibited Products】 ・Resin bond diamond grinding pad "SQUADRO-G2" ・Metal bond diamond grinding pad "PLATO" ・Metal composite pad "IRINO-PROSiC" ・"PAD-EASE-PRO" for easy attachment and detachment of pads ・Ultra-fine diamond manufacturing technology for mechanical fine processing We will showcase a variety of grinding and polishing products for SiC, GaN, and other materials, focusing on "pads that can easily replace loose abrasive processing equipment with fixed abrasives" and "nano-sized diamonds for finishing polishing of difficult-to-CMP materials." We invite everyone to come and visit us!

At the booth of Mabuchi S&T Co., Ltd., a general trading company for materials and equipment related to optics and electronics, you can see the following products: - SQUADRO: A diamond grinding pad that can be attached to the base plate of existing equipment, eliminating detachment! - PLATO: A diamond grinding pad characterized by high grinding performance and long lifespan! Recommended as a substitute for waterproof abrasive paper. - IRINO: A composite pad of copper and resin recommended for processing ultra-hard materials such as SiC and sapphire. - IC OPTIC Puck: A polyurethane block for polishing optical materials. We sincerely look forward to your visit. Mabuchi S&T Co., Ltd. website https://www.mabuchist.co.jp/

At Pureon, we are collaborating with major next-generation power semiconductor manufacturers in Europe and the United States to contribute to the development of EVs. In the following case book, we will introduce examples of slicing SiC ingots and wafer processing used in next-generation power semiconductors. If you are having trouble with processing SiC or GaN, please feel free to consult us. ★ Streamlining the slicing of SiC ingots using a multi-wire saw! https://premium.ipros.jp/pureon/catalog/detail/656418/?hub=165&categoryId=59887 ★ Reducing processing time for SiC wafers and minimizing defective products! https://premium.ipros.jp/pureon/catalog/detail/646885/?hub=165&categoryId=59887 Additionally, these products have been featured in the overseas semiconductor industry magazine "Compound Semiconductor." https://premium.ipros.jp/pureon/news/detail/95752/?hub=160

Our products have been featured on the cover of the globally acclaimed magazine "Compound Semiconductor," which is widely read in the semiconductor industry. The article introduces products for the next-generation semiconductor "SiC (Silicon Carbide)," which is gaining attention for its high power and miniaturization in electronics, starting with electric vehicles. Although it's in English, please feel free to take a look: https://compoundsemiconductor.net/article/114825/The_Secret_Sauce_Of_Silicon_Carbide We also welcome inquiries regarding our products for SiC. Please feel free to contact us.

Due to the change of our company name and the relocation of our office, we have completely renewed our company brochure. It includes introductions to our new products and our factory. If you wish, please download it from the catalog page for your use. ----- Micro Diamond, which has contributed to customers through precision classification, has acquired the American CMP-related company Eminess Technology and has become Pureon. In addition to our high-quality diamond-related products, we will also accumulate know-how regarding final finishing CMP in-house. What is important for our customers is the final finish. Even now, we receive inquiries about our diamond polishing with the aim of shortening the CMP process time. In the future, we will comprehensively accept consultations from grinding and polishing to CMP.