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You can see our products at OPIE '25!
At the booth of Mabuchi S&T Co., Ltd., a general trading company dealing with materials and equipment related to optics and electronics, we will be showcasing our products! 【Event Overview】 ■ Dates: …
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We will exhibit at the SiC, GaN Processing Technology Exhibition 2025!
At the SiC and GaN Processing Technology Exhibition 2025, you can see diamond grinding pads and metal composite pads at the Pure on Japan booth! 【Event Overview】 ■ Dates: March 5 (Wednesday) to March 7 (Friday), 2025, 10:00 AM to 5:00 PM ■ Venue: Makuhari Messe, Exhibition Hall 8 (2-1 Nakase, Mihama-ku, Chiba City, Chiba Prefecture) ■ Admission Fee: Free (Pre-registration required) ■ Booth Number: S-16 【Exhibited Products】 ・Resin bond diamond grinding pad "SQUADRO-G2" ・Metal bond diamond grinding pad "PLATO" ・Metal composite pad "IRINO-PROSiC" ・"PAD-EASE-PRO" for easy attachment and detachment of pads ・Ultra-fine diamond manufacturing technology for mechanical fine processing We will showcase a variety of grinding and polishing products for SiC, GaN, and other materials, focusing on "pads that can easily replace loose abrasive processing equipment with fixed abrasives" and "nano-sized diamonds for finishing polishing of difficult-to-CMP materials." We invite everyone to come and visit us!
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You can see our products at the High-Performance Ceramics Exhibition (CERAMIC JAPAN)!
At the booth of Mabuchi S&T Co., Ltd., a general trading company for materials and equipment related to optics and electronics, you can see the following products: - SQUADRO: A diamond grinding pad that can be attached to the base plate of existing equipment, eliminating detachment! - PLATO: A diamond grinding pad characterized by high grinding performance and long lifespan! Recommended as a substitute for waterproof abrasive paper. - IRINO: A composite pad of copper and resin recommended for processing ultra-hard materials such as SiC and sapphire. - IC OPTIC Puck: A polyurethane block for polishing optical materials. We sincerely look forward to your visit. Mabuchi S&T Co., Ltd. website https://www.mabuchist.co.jp/
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You can see the optical material polyurethane block "IC OPTIC Puck" at OPIE '24!
At the booth of Mabuchi S&T Co., Ltd., a general trading company dealing with materials and equipment related to optics and electronics, you can see the polyurethane block "IC OPTIC Puck" for optical materials. This product can be molded according to your preferences, and both pre-molded and post-molded versions will be available for viewing during the event. We sincerely look forward to your visit. Mabuchi S&T Co., Ltd. website: https://www.mabuchist.co.jp/
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Our company page on Ipros has become easier to read!
Thank you for visiting our company website and the Ipros site regularly. We have renewed our company page on Ipros to provide you with more information about our company. <Renewal Points> 1. We have expanded the images on the product and service pages. 2. Our products will be regularly featured in Ipros original special features. (The next features will include the "High-Performance Metals Special" and the "Ceramics Special," starting on April 8.) We will continue to strive to deliver information, and we appreciate your continued support.
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We have started handling the optical material polishing polyurethane block 'IC OPTIC Puck'!
We have started handling the optical material polishing polyurethane block "IC OPTIC Puck." IC OPTIC Puck is a urethane pad with a fine pore structure recommended for polishing flat and spherical optical materials. It can be used with high-speed CNC and spindle polishing equipment. Due to its ease of processing, it allows for reshaping into spherical forms and groove machining at the customer's location. It is recommended to use it with a low-viscosity dispersion type slurry. If you are having trouble polishing optical materials with sudden radii or other difficult shapes, please feel free to contact us.
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Would you like to switch from waterproof grinding paper to diamond grinding pads?
On April 1, 2023, the Labor Safety and Health Regulations were revised, and the SiC (silicon carbide) abrasive particles contained in waterproof grinding paper were designated as "carcinogenic substances," requiring that work records and health examination results be preserved for 30 years. Additionally, protective gear such as goggles and gloves must be worn during work. Due to these requirements, an increasing number of users are considering alternatives to waterproof grinding paper containing SiC abrasive particles. Why not take this opportunity to switch to the diamond grinding pad "PLATO"?
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We have revamped the catalog for the diamond grinding pad "SQUADRO"!
We have renewed the catalog in conjunction with the product renewal of the diamond grinding pads "SQUADRO." If you wish, please download it from the catalog page for your use. 【Renewal Details】 *Applicable to SQUADRO-G2/M2/H2. ■ A new manufacturing process allows for quicker delivery times. ■ We can now provide pads in a single piece with outer diameters ranging from 200 to 1,200mm. * Sizes larger than this will be provided in multiple pieces that are bonded together. * We will manufacture to sizes tailored to customer specifications. 【Product Lineup】 SQUADRO-G2: A pad suitable for materials such as glass and lithium tantalate. SQUADRO-M / M2: Features a medium-hard bond that retains abrasive grains, making it suitable for precision grinding of metals, ceramics, and glass. SQUADRO-H / H2: Retains abrasive grains with a hard bond, making it suitable for precision grinding of hard materials and ceramics. SQUADRO-O / OWH: A pad specialized for precision grinding of optical materials. There is a relatively large abrasive grain size O, and sizes up to 1μm for OWH.
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We have created a case study document on sapphire polishing using the diamond grinding pad "PLATO"!
Diamond grinding pads are sheet-like grinding tools that secure diamond abrasives to metal plates or urethane pads. They are used by adhering them to the polishing plates currently in use. In recent years, they have gained attention as an alternative to free abrasives from the perspective of environmental impact and maintenance. In this experiment, we investigated the grinding rate and surface roughness on sapphire samples, which are difficult-to-grind materials. The results showed that both the 'PLATO' and 'SQUADRO' grinding pads were effective, with the PLATO-40 µm demonstrating a very high grinding rate. The possibility of achieving sapphire grinding with fixed grinding pads, a long-standing challenge in the industry, is now becoming clearer. If you are interested, please feel free to contact us through the inquiry form.
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We have created polishing data materials for blue plates, quartz, BK7, and aluminum nitride using the diamond grinding pad "SQUADRO"!
The diamond grinding pad "SQUADRO" is a sheet-like grinding tool that fixes diamond abrasives to a metal plate or urethane pad. It is used by attaching it to the polishing plate you are currently using. In recent years, it has gained attention as an alternative to free abrasives from the perspective of environmental impact and maintenance. This time, we used "SQUADRO-G" with particle sizes of 15μm, 30μm, and 45μm to process commonly used glass materials (blue plate glass, quartz glass, BK7 glass) and aluminum nitride, investigating the grinding rate and surface roughness Ra. ★ Summary of Results: Various Glass Materials Changing the particle size of SQUADRO-G from 15μm to 30μm significantly increases the processing rate. It is recommended to start with the 30μm size, which offers a good balance between rate and roughness. ★ Summary of Results: Aluminum Nitride The processing rate increases in proportion to the particle size of SQUADRO-G. It is recommended to start with the 30μm size, which offers a good balance between rate and roughness. If you are interested, please feel free to contact us through the inquiry form.
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We have published examples of SiC wafer processing!
At Pureon, we are collaborating with major next-generation power semiconductor manufacturers in Europe and the United States to contribute to the development of EVs. In the following case book, we will introduce examples of slicing SiC ingots and wafer processing used in next-generation power semiconductors. If you are having trouble with processing SiC or GaN, please feel free to consult us. ★ Streamlining the slicing of SiC ingots using a multi-wire saw! https://premium.ipros.jp/pureon/catalog/detail/656418/?hub=165&categoryId=59887 ★ Reducing processing time for SiC wafers and minimizing defective products! https://premium.ipros.jp/pureon/catalog/detail/646885/?hub=165&categoryId=59887 Additionally, these products have been featured in the overseas semiconductor industry magazine "Compound Semiconductor." https://premium.ipros.jp/pureon/news/detail/95752/?hub=160
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Our products for SiC have been featured in the magazine "Compound Semiconductor"!
Our products have been featured on the cover of the globally acclaimed magazine "Compound Semiconductor," which is widely read in the semiconductor industry. The article introduces products for the next-generation semiconductor "SiC (Silicon Carbide)," which is gaining attention for its high power and miniaturization in electronics, starting with electric vehicles. Although it's in English, please feel free to take a look: https://compoundsemiconductor.net/article/114825/The_Secret_Sauce_Of_Silicon_Carbide We also welcome inquiries regarding our products for SiC. Please feel free to contact us.
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We have created a collection of processing examples for diamond grinding pads【PLATO】!
A diamond grinding pad is a plate-shaped grinding tool that fixes diamond abrasives to a metal plate or urethane pad. It is used by attaching it to the polishing plate you are currently using. In recent years, it has gained attention as an alternative to free abrasives from the perspective of environmental impact and maintenance. In this collection of processing case studies we have created, we have summarized the applications and common challenges of the diamond grinding pad "PLATO" by processing work type, as well as the benefits of using PLATO. Please download it and check it out!
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Pure On Japan Co., Ltd. has renewed its company profile!
Due to the change of our company name and the relocation of our office, we have completely renewed our company brochure. It includes introductions to our new products and our factory. If you wish, please download it from the catalog page for your use. ----- Micro Diamond, which has contributed to customers through precision classification, has acquired the American CMP-related company Eminess Technology and has become Pureon. In addition to our high-quality diamond-related products, we will also accumulate know-how regarding final finishing CMP in-house. What is important for our customers is the final finish. Even now, we receive inquiries about our diamond polishing with the aim of shortening the CMP process time. In the future, we will comprehensively accept consultations from grinding and polishing to CMP.
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Notice of Office Relocation
We are pleased to announce that our company will be relocating our headquarters office as part of our business expansion, as detailed below. Please note that we will continue to operate as usual at our old office until Friday, July 30. Additionally, due to the relocation, our main telephone and fax numbers will change as follows. We apologize for the inconvenience and kindly ask you to update your records accordingly. We would appreciate it if you could inform the relevant parties within your company about this address change. Taking this opportunity, all of our employees will strive even harder, and we look forward to your continued support. 【Details】 ■ Start date: Monday, August 2, 2021 ■ New address: 〒231-0021 7 Nihon Odori, Naka Ward, Yokohama City, Kanagawa Prefecture, 5th Floor, Gojinsha Yokohama Nihon Odori 7 Building ■ Phone number: 045-264-8425 ■ Fax number: 045-264-9718 ■ Inquiries: cs.jp@pureon.com
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Notice of Company Name Change
In December 2020, our company Microdiamant acquired Eminess Technologies (www.eminess.com), which is engaged in CMP process-related business in the United States. With this acquisition, we will be able to offer CMP-related technologies in addition to our products related to grinding and polishing of diamonds and CBN. Furthermore, from the perspective of brand restructuring associated with this acquisition, our company name will be changed as follows. We sincerely apologize for any inconvenience this may cause, but we would like to proceed with the necessary procedures for the name change. We are committed to addressing our customers' technical challenges more broadly and comprehensively in grinding, polishing, and CMP. We look forward to your continued support. 【Details】 ■ New Company Name: Pureon Japan Co., Ltd. ■ English Name: Pureon Ltd. ■ Name Change Date: May 1, 2021
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Campaign for free provision of polishing products using high-precision graded diamonds until August 31, 2021.
We are pleased to announce that Pureon Japan Co., Ltd. will be conducting a free product offering campaign using high-precision classified diamonds, in order to allow more customers to experience our products. Please note that this campaign will be handled through our partner company, Anchor Tech Co., Ltd. The products eligible for the campaign are as follows. *Period: Until August 31, 2021 ■ Diamond slurry (oil-based/water-based, single crystal/polycrystalline, dispersed/non-dispersed) ■ Diamond gel (oil-based/water-based, single crystal/polycrystalline) ■ Diamond paste (oil-based, single crystal/polycrystalline) *Please note that quantities are limited, and there may be cases where the requested product samples are not available. *This offer is limited to customers who have never purchased our products, and will be handled by lottery.