Pure On Japan Co., Ltd. has renewed its company profile!

ピュアオンジャパン

Due to the change of our company name and the relocation of our office, we have completely renewed our company brochure. It includes introductions to our new products and our factory. If you wish, please download it from the catalog page for your use. ----- Micro Diamond, which has contributed to customers through precision classification, has acquired the American CMP-related company Eminess Technology and has become Pureon. In addition to our high-quality diamond-related products, we will also accumulate know-how regarding final finishing CMP in-house. What is important for our customers is the final finish. Even now, we receive inquiries about our diamond polishing with the aim of shortening the CMP process time. In the future, we will comprehensively accept consultations from grinding and polishing to CMP.

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Related product information

Diamond grinding pad "PLATO": A grinding pad that can also cut sapphire.
Metal bond grinding pads with high grindability, long lifespan, and compatibility with almost all cooling lubricants (coolants).

The diamond grinding pad PLATO is recommended for grinding materials such as ceramics, glass, and various metals. It maintains a high grinding rate due to diamond abrasives fixed with a metal bond. PLATO is highly praised for its excellent grindability and long lifespan. Because it is metal bond type, it is compatible with almost all cooling lubricants (coolants). 【Examples of PLATO processing are now available】 We have created a document summarizing examples of processing using PLATO for sapphire, white alumina, and sample polishing. For more details, please refer to the catalog at the bottom of the page! *The diamond grinding pad is a plate-shaped grinding tool that fixes diamond abrasives to a metal plate or urethane pad. It is used by attaching it to the polishing plate you are currently using. In recent years, it has gained attention as an alternative to free abrasives from the perspective of environmental impact and maintenance. In addition to the metal bond type PLATO, Pureon also offers the resin bond type SQUADRO in its lineup.
Diamond grinding pad "SQUADRO-G2": A powerful method for removing free abrasive grains.
Detach and release! Can be attached to the existing device's base plate. A diamond grinding pad that enables high-quality processing of glass materials easily, cleanly, and efficiently.

【Product Specifications】 - Diameter: 200~1,200mm *Sizes larger than this will be provided in multiple pieces that are bonded together. *Manufactured to customer specifications. - Diamond sizes: 15μm/30μm/45μm/60μm - Thickness: 0.6mm - Bonding material: Resin bond - Carrier material: Polycarbonate - Back processing: Self-adhesive tape/Metal plate/Magnetic foil ■ SQUADRO is available in three types of bonding materials tailored to different applications. SQUADRO-M / M2: This medium-hard bond retains the abrasive grains and is suitable for precision grinding of metals, ceramics, and glass. SQUADRO-H / H2: This hard bond retains the abrasive grains and is suitable for precision grinding of hard materials and ceramics. SQUADRO-O / OWH: This pad is specialized for precision grinding of optical materials. There are larger abrasive grains available in size O and up to 1μm in OWH.
Metal composite material grinding pad "IRINO": Enhancing the performance of existing grinding machines.
Achieves high polishing rates and excellent surface finish on materials such as SiC and sapphire!

【Product Specifications】 - Thickness: 1mm - Bonding Material: Resin Bond - Carrier Material: Polycarbonate - Diameter: 200 to 1,200 mm *Sizes larger than this will be provided in multiple pieces that are bonded together. - Back Processing: Self-adhesive tape