We will exhibit at the SiC, GaN Processing Technology Exhibition 2025!

ピュアオンジャパン

At the SiC and GaN Processing Technology Exhibition 2025, you can see diamond grinding pads and metal composite pads at the Pure on Japan booth! 【Event Overview】 ■ Dates: March 5 (Wednesday) to March 7 (Friday), 2025, 10:00 AM to 5:00 PM ■ Venue: Makuhari Messe, Exhibition Hall 8 　　　(2-1 Nakase, Mihama-ku, Chiba City, Chiba Prefecture) ■ Admission Fee: Free (Pre-registration required) ■ Booth Number: S-16 【Exhibited Products】・Resin bond diamond grinding pad "SQUADRO-G2" ・Metal bond diamond grinding pad "PLATO" ・Metal composite pad "IRINO-PROSiC" ・"PAD-EASE-PRO" for easy attachment and detachment of pads ・Ultra-fine diamond manufacturing technology for mechanical fine processing We will showcase a variety of grinding and polishing products for SiC, GaN, and other materials, focusing on "pads that can easily replace loose abrasive processing equipment with fixed abrasives" and "nano-sized diamonds for finishing polishing of difficult-to-CMP materials." We invite everyone to come and visit us!

Date and time Wednesday, Mar 05, 2025 ～ Friday, Mar 07, 2025
10:00 AM ～ 05:00 PM
Capital Makuhari Messe, Exhibition Hall 8 (2-1 Nakase, Mihama Ward, Chiba City, Chiba Prefecture)
Entry fee Free Completely pre-registration system

Related product information

Diamond grinding pad "SQUADRO-G2": A powerful method for removing free abrasive grains.
Detach and release! Can be attached to the existing device's base plate. A diamond grinding pad that enables high-quality processing of glass materials easily, cleanly, and efficiently.

【Product Specifications】 - Diameter: 200~1,200mm *Sizes larger than this will be provided in multiple pieces that are bonded together. *Manufactured to customer specifications. - Diamond sizes: 15μm/30μm/45μm/60μm - Thickness: 0.6mm - Bonding material: Resin bond - Carrier material: Polycarbonate - Back processing: Self-adhesive tape/Metal plate/Magnetic foil ■ SQUADRO is available in three types of bonding materials tailored to different applications. SQUADRO-M / M2: This medium-hard bond retains the abrasive grains and is suitable for precision grinding of metals, ceramics, and glass. SQUADRO-H / H2: This hard bond retains the abrasive grains and is suitable for precision grinding of hard materials and ceramics. SQUADRO-O / OWH: This pad is specialized for precision grinding of optical materials. There are larger abrasive grains available in size O and up to 1μm in OWH.
Metal composite material grinding pad "IRINO": Enhancing the performance of existing grinding machines.
Achieves high polishing rates and excellent surface finish on materials such as SiC and sapphire!

【Product Specifications】 - Thickness: 1mm - Bonding Material: Resin Bond - Carrier Material: Polycarbonate - Diameter: 200 to 1,200 mm *Sizes larger than this will be provided in multiple pieces that are bonded together. - Back Processing: Self-adhesive tape
Diamond grinding pad "PLATO": A grinding pad that can also cut sapphire.
Metal bond grinding pads with high grindability, long lifespan, and compatibility with almost all cooling lubricants (coolants).

The diamond grinding pad PLATO is recommended for grinding materials such as ceramics, glass, and various metals. It maintains a high grinding rate due to diamond abrasives fixed with a metal bond. PLATO is highly praised for its excellent grindability and long lifespan. Because it is metal bond type, it is compatible with almost all cooling lubricants (coolants). 【Examples of PLATO processing are now available】 We have created a document summarizing examples of processing using PLATO for sapphire, white alumina, and sample polishing. For more details, please refer to the catalog at the bottom of the page! *The diamond grinding pad is a plate-shaped grinding tool that fixes diamond abrasives to a metal plate or urethane pad. It is used by attaching it to the polishing plate you are currently using. In recent years, it has gained attention as an alternative to free abrasives from the perspective of environmental impact and maintenance. In addition to the metal bond type PLATO, Pureon also offers the resin bond type SQUADRO in its lineup.
Liquid Diamond GAF for Slurry Formulation: Coagulation-Free Polishing
Even submicron-sized easily agglomerating diamonds achieve scratch-free and highly reproducible polishing with our unique agglomeration-free processing technology!

【Other Features】 ■ High concentration diamond + deionized water ■ Please dilute with deionized water before use ■ The diamond concentration can be formulated by mixing the weighed liquid diamond with the required liquid base ■ Achieves scratch-free results with dispersed diamond abrasive particles that have no aggregation ■ The slurry preparation process can be dramatically simplified *For more details, please refer to the PDF document or feel free to contact us.