Our products for SiC have been featured in the magazine "Compound Semiconductor"!

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Our products have been featured on the cover of the globally acclaimed magazine "Compound Semiconductor," which is widely read in the semiconductor industry. The article introduces products for the next-generation semiconductor "SiC (Silicon Carbide)," which is gaining attention for its high power and miniaturization in electronics, starting with electric vehicles. Although it's in English, please feel free to take a look: https://compoundsemiconductor.net/article/114825/The_Secret_Sauce_Of_Silicon_Carbide We also welcome inquiries regarding our products for SiC. Please feel free to contact us.

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Metal composite material grinding pad "IRINO": Enhancing the performance of existing grinding machines.
Achieves high polishing rates and excellent surface finish on materials such as SiC and sapphire!

【Product Specifications】 - Thickness: 1mm - Bonding Material: Resin Bond - Carrier Material: Polycarbonate - Diameter: 200 to 1,200 mm *Sizes larger than this will be provided in multiple pieces that are bonded together. - Back Processing: Self-adhesive tape
Diamond slurry for wire saw "WSG": Glycol-based
Glycol-based diamond slurry that improves cutting speed and achieves high reproducibility for multi-wire saws. Water-soluble, easy to clean, and environmentally friendly!

【Product Characteristics】 - Carrier liquid: Glycol - Typical application: Multi-wire saw - Density: 1.05 g/cm³ - Typical diamond type/abrasive size: MONO-ECO 3 – 6 micron - Typical diamond concentration: 250 cts/l
Water-based diamond suspension "OPW": Slurry for optical materials
Slurry formulated with a formula that achieves excellent polishing results for various optical materials such as fluorite!

【Product Characteristics】 - Liquid Type Water-based - Typical Applications Polishing optical lenses made from various materials using submicron-sized diamond particles - Density 1.04 g/cm³