Wire bonding device

Features: - Automated transport system - Up to 30% improvement in UPH - Capable of bonding to balls as small as 22µm with 0.5mil wire - Dual magnification optical path, dual-color coaxial light 〇 Other ASM Equipment: - ALSI: Multi-laser dicing system - ASM PT: Wire bonding machine - ASM PT: 2D and 3D package appearance inspection system - ASM PT: Other die bonding machines (alignment accuracy from 0.2µm to 25µm) 〇 ASM Equipment Installation Achievements (Total domestic and international): 2,000 units of die bonders per year, 4,000 units of wire bonders per year