Notice of Participation in "SEMICON JAPAN 2023"
Various manufacturers' products are scheduled to be exhibited! Such as die bonders and mask aligner devices.
Kanematsu PWS Corporation will be exhibiting at "SEMICON JAPAN 2023" held at Tokyo Big Sight. We plan to showcase various products, including ASMPT's backend equipment (die bonders, wire bonders, etc.), SUSS's mask aligners, coaters/developers, and more. We sincerely look forward to your visit. 【Exhibition Overview】 ■ Date: December 13 (Wed) to December 15 (Fri), 2023, 10:00 AM to 5:00 PM ■ Venue: Tokyo Big Sight (East Exhibition Hall) Hall 1 ■ Booth Location: 1704 ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 *For more details, please refer to the related links or feel free to contact us.
basic information
【List of Exhibiting Manufacturers】 ■ASMPT: Backend equipment (die bonders, wire bonders, sintering equipment, laser dicing equipment) ■SUSS: Mask aligner equipment, coater/developer ■INNOLAS: Wafer marking equipment, wafer sorting equipment ■Nova Ancosys: Plating solution analysis equipment ■MPP: Wedge tools, manual wire bonders ■NS Technologies: IC test handlers ■Arnea Laboratory: Non-contact wafer measurement equipment *For more details, please refer to the related links or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the related links or feel free to contact us.
