Multi-Laser Dicing Equipment ICA1205

ICA1205 is a multi-laser dicing system that employs a multi-beam structure. The multi-laser design enables the following: - Finer cutting capability - Reduced temperature during cutting - Minimized impact on the substrate Applications: RFIC, discrete devices, thin wafers, LEDs, MEMS, memory, power devices 〇 Other ASM equipment available: - ALSI: Multi-laser dicing system - ASM PT: Wire bonder - ASM PT: 2D and 3D package appearance inspection system - ASM PT: Other die bonders (alignment accuracy of 0.2µm to 25µm) 〇 ASM equipment installation achievements (total domestic and international): 2,000 die bonders per year, 4,000 wire bonders per year.