ASMPT Multi-Laser Dicing Machine ICA1205
ICA1205 is a multi-laser dicing device that employs a multi-beam structure.
Achieved through a multi-laser structure: - Enables finer cutting - Reduces temperature during cutting - Minimizes impact on the substrate Applications: RFIC, discrete, thin wafer, LED, MEMS, memory, power devices 〇 Other ASM equipment handled: - Wire bonder equipment - 2D and 3D package appearance inspection equipment - Other die bonder equipment (alignment accuracy 0.2µm to 25µm) 〇 ASMPT equipment installation achievements (total domestic and international): 2,000 die bonders per year, 4,000 wire bonders per year
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Applications: RFIC, discrete, thin wafer, LED, MEMS, memory, power devices
