Die Bonder & Flip Chip Bonder
Die Bonder & Flip Chip Bonder
ASM Pacific Technology provides various solutions with semiconductor packaging equipment for next-generation high-speed communication modules such as silicon photonics, high-precision lasers for autonomous driving, automotive MEMS sensors, and manufacturing processes for next-generation displays and light source manufacturers. We can offer equipment with alignment accuracy ranging from ±0.3µm to ±25µm, depending on the required precision.
1～11 item / All 11 items
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ASMPT's ultra-high precision flip chip bonder 'NANO'
It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.
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ASMPT manufactured flip chip bonder/die bonder AFCPlus
AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.
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ASMPT manufactured flip chip bonder - Novaplus
Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.
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ASMPT manufactured flip chip bonder/die bonder CoS
CoS (Chip on Submount) is a high-precision die/flip chip bonder.
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ASMPT manufactured die bonder Photon Pro
Multi-Wafer Handling Die Bonder (Auto)
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ASMPT AD830Plus Epoxy Die Bonder
The AD830Plus is an ultra-fast epoxy die bonder with a cycle time of 0.16 seconds per chip.
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ASMPT manufactured AD838L-G2 epoxy die bonder
AD838L-G2 is an epoxy die bonder with a strong track record in LED applications.
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ASMPT manufactured MEGA DA multi-chip compatible bonder NEW
Multi-chip die bonder
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Notice of Participation in "SEMICON JAPAN 2023"
Various manufacturers' products are scheduled to be exhibited! Such as die bonders and mask aligner devices.
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Dai Bonder "MEGA"
Equipped with a comprehensive inspection feature! It is possible to check the quality before and after bonding.
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Wafer transport robot & pre-aligner repair
Repair of wafer transport robot and pre-aligner
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