ASMPT AD830Plus Epoxy Die Bonder
The AD830Plus is an ultra-fast epoxy die bonder with a cycle time of 0.16 seconds per chip.
The AD830Plus is a device capable of ultra-fast bonding of diced chips to substrates or lead frames. It has a proven track record in various applications, including LED and sensor-related fields. 【Device Features】 - Alignment accuracy: ±25.4µm - Ultra-fast bonding - Equipped with functionality to easily pick up various thin chips - Capable of handling various materials (such as long substrates and reel supply) - Dual dispense/dual stamping functionality - Comprehensive inspection features (before and after bonding) 【Main Specifications】 - Alignment accuracy: ±25.4µm - UPH: 0.16 seconds (163 milliseconds) - Die size compatibility: 0.15mm × 0.15mm – 5.08mm × 5.08mm - Substrate size compatibility: Length 110mm – 300mm, Width 12mm – 102mm We will propose the optimal device based on alignment accuracy, cycle time, die size, and other factors. Please feel free to contact us when looking for a die bonder.
basic information
ASM's flip chip/die bonder offers alignment accuracy ranging from 0.2μm to 25μm, with cycle times from 18 seconds to 0.16 seconds. We can propose die bonders based on the size of the die and substrate, as well as the bonding method. In addition to die bonders, we have a wide lineup of backend equipment, including laser dicing machines, wire bonding machines, AOI equipment, molding machines, and sintering machines. *Please feel free to contact us if you are looking for backend equipment.
Price range
Delivery Time
Model number/Brand name
AD830Plus
Applications/Examples of results
We have a wealth of experience in various applications such as LED-related, Opto solutions, and sensor-related fields.
