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  Exposure device(2)

  The mask aligners from Süss MicroTec, equipped with a sophisticated exposure optical system, are ideal for thick and thin film coating layer applications and boast the highest alignment accuracy. They offer a wide range of products, from research and development equipment to fully automated mass production systems. Süss MicroTec's mask aligners are particularly used in lithography applications in the fields of MEMS, advanced packaging, 3D packaging, compound semiconductors, power devices, solar energy, nanotechnology, and wafer-level optics.

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  Dual-Sided Position Accuracy Measuring Device DSM8Gen2(1)

  The DSM8/200 Gen2 is a dual-side positioning measurement device compatible with 2 to 8-inch wafers. It is equipped with a function to eliminate TIS (equipment-induced errors), achieving high-precision measurements in dual-side patterning substrates in fields such as MEMS, power devices, and optical devices.

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  Inkjet device(1)

  The tabletop inkjet printer LP50 is an R&D inkjet printer equipped with a high-precision stage alignment system. It can be used for direct application of epoxy resin, polyimide, acrylic resin, and UV-curable resin, as well as for applying resist and passivation films to wafers, and for direct application of pastes containing Ag or Cu nanoparticles. It is compatible with heads from Fujifilm, Konica Minolta, Xaar, and Canon.

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  Automatic analysis device for semiconductor plating solution(1)

  Our company handles the "Automatic Analysis System for Plating Solutions for Semiconductors" from ancosys, which is widely adopted by major semiconductor and electronic component manufacturers. It performs automatic online analysis of various plating solutions such as Cu, Au, Ni, and PbSn, and can provide feedback for process management by automatically adding additives. Due to its modular structure, maintenance is easy, and technical support is robust. 【About ancosys】 ancosys is a global company specializing in semiconductor plating process monitoring and is skilled in providing solutions across the entire process line, including fully automatic plating analysis systems. *For more details, please contact us.

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  Multi-Laser Dicing Equipment ICA1205(1)

  ICA1205 is a multi-laser dicing system that employs a multi-beam structure. The multi-laser design enables the following: - Finer cutting capability - Reduced temperature during cutting - Minimized impact on the substrate Applications: RFIC, discrete devices, thin wafers, LEDs, MEMS, memory, power devices 〇 Other ASM equipment available: - ALSI: Multi-laser dicing system - ASM PT: Wire bonder - ASM PT: 2D and 3D package appearance inspection system - ASM PT: Other die bonders (alignment accuracy of 0.2µm to 25µm) 〇 ASM equipment installation achievements (total domestic and international): 2,000 die bonders per year, 4,000 wire bonders per year.

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  Die Bonder & Flip Chip Bonder(11)

  ASM Pacific Technology provides various solutions with semiconductor packaging equipment for next-generation high-speed communication modules such as silicon photonics, high-precision lasers for autonomous driving, automotive MEMS sensors, and manufacturing processes for next-generation displays and light source manufacturers. We can offer equipment with alignment accuracy ranging from ±0.3µm to ±25µm, depending on the required precision.

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  Wire bonding device(2)

  Features: - Automated transport system - Up to 30% improvement in UPH - Capable of bonding to balls as small as 22µm with 0.5mil wire - Dual magnification optical path, dual-color coaxial light 〇 Other ASM Equipment: - ALSI: Multi-laser dicing system - ASM PT: Wire bonding machine - ASM PT: 2D and 3D package appearance inspection system - ASM PT: Other die bonding machines (alignment accuracy from 0.2µm to 25µm) 〇 ASM Equipment Installation Achievements (Total domestic and international): 2,000 units of die bonders per year, 4,000 units of wire bonders per year

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  Package Post-Inspection Device Skyhawk(0)

  One-stop automatic optical inspection package post-inspection device Features: - Capable of inspecting up to 33 items - Advanced 2D and 3D all-in-one vision system - Ball height measurement - Measurement of wire loops and wire lengths - Dual head with two independent inspection systems Applications: Semiconductor-related devices 〇 Other ASM equipment handled - ALSI: Multi-laser dicing equipment - ASM PT: Wire bonder equipment - ASM PT: 2D and 3D package appearance inspection equipment - ASM PT: Other die bonder equipment (alignment accuracy of 0.2µm to 25µm) 〇 ASM equipment installation achievements (total domestic and international): 2,000 units of die bonders annually, 4,000 units of wire bonders annually

Product/Service List (43)