NS Technologies Tri-Temp IC Handler NS-8080MT

The layout and operability of the NS series remain unchanged, achieving stable low-temperature measurements.

last updated Sep 02, 2025

Aemulus Mixed Signal Tester WSH5600

High Cost Performance Mixed Signal Tester

last updated Aug 28, 2025

Aemulus Mixed Signal Tester AMB5600

Changing the common sense of testing. AMB5600, an innovative platform that supports diverse ICs.

last updated Aug 22, 2025

Aemulus Open Short Tester AMB1831

Supports up to 4096 channels, a multi-site open short tester that achieves the fastest test time in the industry.

last updated Aug 22, 2025

NS Technologies Inc. IC Test Handler NS-8040SH

Middle-range model: A handler that thoroughly pursues excellent stability and significant reduction in working time.

last updated Aug 15, 2025

Wafer transport robot & pre-aligner repair

Repair of wafer transport robot and pre-aligner

last updated Mar 12, 2025

ASMPT Corporation Back-end Equipment

ASMPT is a backend equipment manufacturer based in Singapore.

last updated Sep 11, 2024

ASMPT manufactured eutectic die bonder

High-speed eutectic die bonder

last updated Sep 10, 2024

Dai Bonder "MEGA"

Equipped with a comprehensive inspection feature! It is possible to check the quality before and after bonding.

last updated Nov 15, 2023

Notice of Participation in "SEMICON JAPAN 2023"

Various manufacturers' products are scheduled to be exhibited! Such as die bonders and mask aligner devices.

last updated Nov 15, 2023

ASMPT manufactured MEGA DA multi-chip compatible bonder NEW

Multi-chip die bonder

last updated Sep 05, 2023

NS Technologies Co., Ltd. IC Test Handler NS-8080SH

Middle Range Model: A handler that thoroughly pursues excellent stability and significant reduction in work time.

last updated Aug 15, 2025

NS Technologies, Inc. IC Test Handler NS-8080MS

High-end model: A handler that thoroughly pursues excellent stability and significant reduction in working hours.

last updated Aug 15, 2025

NS Technologies Inc. IC Test Handler NS-8160MS

High-end model: A handler that thoroughly pursues excellent stability and significant reduction in working hours.

last updated Aug 15, 2025

NS Technologies Inc. IC Test Handler NX-1032XS

Flagship model: A handler that thoroughly pursues excellent stability and significant reductions in working time.

last updated Jul 22, 2025

ASMPT's epoxy die bonder "INFINITE" <New Release>

Bonding chips to substrates or lead frames quickly and accurately.

last updated Mar 30, 2023

ASMPT manufactured AD838L-G2 epoxy die bonder

AD838L-G2 is an epoxy die bonder with a strong track record in LED applications.

last updated Sep 13, 2022

ASMPT's ultra-high precision flip chip bonder 'NANO Pro'

Achieved alignment accuracy of ±0.2μm. Extensive track record of implementation, primarily in optical communication and silicon photonics.

last updated Sep 05, 2023

ASMPT manufactured sintering equipment

The company's equipment is designed for high-power applications such as power devices.

last updated Sep 05, 2023

ASMPT manufactured die bonder Photon Pro

Multi-Wafer Handling Die Bonder (Auto)

last updated Sep 05, 2023

ASMPT AD830Plus Epoxy Die Bonder

The AD830Plus is an ultra-fast epoxy die bonder with a cycle time of 0.16 seconds per chip.

last updated Sep 13, 2022

Bosch Rexroth planetary roller screw assembly

Compact yet high thrust and high rigidity.

last updated Sep 07, 2021

Bosch Rexroth Ball Screw Assembly

Achieving smooth operation through the optimal ball circulation method.

last updated Oct 15, 2021

Bosch Rexroth Roller Rail System

High rigidity and long lifespan guide system

last updated Sep 01, 2021

Bosch Rexroth Ball Guide Rail System

High rigidity and long lifespan linear guide system

last updated Oct 15, 2021

SUSS MicroTec Dual-Sided Position Accuracy Measurement Device DSM8Gen2

High-precision measurement of the positional deviation of patterns on the wafer surface/backside.

last updated Aug 24, 2021

SUSS MicroTec's inkjet coating system 'LP50'

Desktop inkjet printer system for semiconductors, PCBs, and printed electronics.

last updated Jan 12, 2023

MPP Corporation's "Manual Wire Bonder iBond5000 Series"

Over 9,000 units delivered worldwide! Bonding is possible with just a click of the mouse. Compact and effective for research and development as well as small-scale production.

last updated Sep 02, 2021

Inolas Corporation's wafer marking device IL2000

InnoLas Semiconductor is headquartered in Munich, Germany, and continues to provide wafer marking equipment globally.

last updated Jun 08, 2021

SUSS MicroTec Manual Mask Aligner MJB4

Manual exposure machine compatible with up to 4-inch square substrates.

last updated Jun 10, 2021