SUSS MicroTec Dual-Sided Position Accuracy Measurement Device DSM8Gen2
High-precision measurement of the positional deviation of patterns on the wafer surface/backside.
The DSM8/200 Gen2 is a dual-sided positioning measurement device compatible with 2 to 8-inch wafers. It is equipped with a function to eliminate TIS (tool-induced errors), achieving high-precision measurements in dual-sided patterning substrates in fields such as MEMS, power devices, and optical devices.
basic information
- Device Specifications Supported wafer size: 2~8 inch wafers Measurement accuracy: 0.2um (3σ) Visible light observation Non-contact pre-aligner - Options Infrared light observation Wafer transport mechanism (DSM200 Gen2)
Price range
Delivery Time
Applications/Examples of results
MEMS, power devices, optical devices, etc.
