ASMPT's epoxy die bonder "INFINITE" <New Release>
Bonding chips to substrates or lead frames quickly and accurately.
"INFINITE" is a device that can bond individual chips to substrates and lead frames with ultra-high speed and precision. It is capable of controlling not only the amount and width of epoxy resin dispensed but also the amount of overflow during bonding. It also features inspection functions before and after dispensing and bonding, making it suitable for various applications such as QFN, BGA, MEMS, and SiP. 【Features】 ■ High-speed bonding of thin chips and large dies ■ Compatible with various epoxy materials, including pressureless sintering materials and high-viscosity materials ■ Alignment accuracy of ±20μm @ 3σ ■ Capable of processing at a maximum speed of 0.19 seconds per chip ■ Die size compatibility: 0.2×0.2 to 9×9mm Substrate size compatibility: Length 100 to 300mm, Width 15 to 100mm *You can view the product documentation from the <PDF download>.
basic information
[About ASMPT's Flip Chip/Die Bonder] We offer a lineup of products with alignment accuracy ranging from 0.2μm to 25μm and cycle times from 18 seconds to 0.16 seconds. We will propose equipment based on the size of the die and substrate, as well as the bonding method. In addition to die bonders, we have a wide range of back-end equipment, including laser dicing machines, wire bonding machines, AOI equipment, molding machines, and sintering machines. *Please feel free to contact us if you are looking for back-end equipment.*
Price information
Please contact us.
Delivery Time
Model number/Brand name
INFINITE
Applications/Examples of results
Various packages and applications such as QFN, BGA, MEMS, SiP, thin chips, and large dies.
