ASMPT manufactured eutectic die bonder
High-speed eutectic die bonder
The AD211Plus-II is a device capable of high-speed eutectic bonding of diced chips to substrates or lead frames. It has a strong track record of implementation for LEDs, including automotive lighting and outdoor lighting. Product Features: - Alignment accuracy: 7μm - Cycle time: 540ms - Mirage prevention function during heat-up - Distinctive work holder/heat-up stage - Control function with a void rate of 3% or less - Extensive domestic and international implementation track record - Applications: Automotive, photonics, LEDs, LiDAR
basic information
Alignment accuracy: ± 7 μm @ 3σ Cycle time: 540 ms Die size compatibility: 0.15 x 0.15 – 2 x 2 mm Substrate size compatibility: up to 102 x 127 mm Joining method: Eutectic
Price information
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Applications/Examples of results
- Applications: Automotive, Photonics, LED, LiDAR
