ASMPT manufactured AD838L-G2 epoxy die bonder
AD838L-G2 is an epoxy die bonder with a strong track record in LED applications.
The AD838L-G2 is a device capable of high-speed bonding of individual chips to a substrate. It also supports multi-die configurations and is equipped with comprehensive inspection features. 【Device Features】 - Alignment accuracy: ±10µm @ 3σ - High-speed bonding possible at approximately 0.25 seconds per chip - Functionality to easily pick up various thin chips - Dual dispense function (supports dots and writing according to various die sizes) - Comprehensive inspection features before and after bonding 【Main Specifications】 - Alignment accuracy: ±10µm @ 3σ - UPH: 14,000 (approximately 0.25 seconds per chip) * Variations may occur depending on bonding materials and die/substrate specifications - Die size compatibility: 0.15 × 0.15 mm – 2.03 × 2.03 mm - Substrate size: Length 60 – 300 mm, Width 60 – 100 mm We will propose the optimal device based on alignment accuracy, cycle time, die size, and other factors. Please feel free to contact us when looking for a die bonder.
basic information
ASMPT's flip chip/die bonder offers alignment accuracy ranging from 0.2μm to 25μm, with cycle times from 18 seconds to 0.16 seconds. We can recommend die bonders based on the size of the die and substrate, as well as the bonding method. In addition to die bonders, we have a wide lineup of back-end equipment, including laser dicing machines, wire bonding machines, AOI equipment, molding machines, and sintering equipment. *Please feel free to contact us if you are looking for back-end equipment.
Price range
Delivery Time
Model number/Brand name
AD838L-G2
Applications/Examples of results
LED-related items such as COB, CSP, phosphor film, and TOcan.
