ASMPT manufactured sintering equipment
The company's equipment is designed for high-power applications such as power devices.
We have started handling the new ASMPT sintering equipment. The company's equipment has a proven track record for worldwide installations and provides solutions for high-power devices. The features of this equipment allow for the bonding of chips with varying sizes and thicknesses simultaneously, thanks to its uniform temperature and special bond head. Additionally, ASMPT has experience in Cu oxidation prevention measures and collaborates with many material manufacturers. Furthermore, we can offer a consistent solution for the sintering process, not only with the sintering equipment but also with multi-laser dicing machines, tacking machines, curing machines, and more. Product Types: - Manual machines for R&D - Semi-automatic machines for mass production - Fully automatic machines for mass production Please feel free to contact us for more details about the equipment.
basic information
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Price information
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Delivery Time
Model number/Brand name
Silver Sam
Applications/Examples of results
For high power applications such as power devices.
