Dai Bonder "MEGA"
Equipped with a comprehensive inspection feature! It is possible to check the quality before and after bonding.
"MEGA" is a device that allows multiple types of chips to be bonded to a single substrate in one pass. By adding options, it is possible to vary the precision within a range of 25μm to 2μm. Additionally, it is equipped with comprehensive inspection functions that allow for quality checks before and after bonding. It can be used for various applications such as small-batch production, mass production, and R&D. 【Overview】 ■ Manufacturer: ASMPT ■ Product Name: Multi-chip compatible die bonder for epoxy bonding, UV bonding *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Specifications】 ■Alignment accuracy: ±2μm to 25μm (standard 25μm) ■Cycle time: up to 0.25 seconds/chip ■Die size compatibility: 0.15×0.15-10×10mm ■Substrate size compatibility ・Length: 50-130mm ・Width: 100-300mm ・Thickness: 0.5-5mm ■Bonding method: Epoxy, UV *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
