ASMPT Corporation Back-end Equipment
ASMPT is a backend equipment manufacturer based in Singapore.
Kanematsu PWS has been the domestic agent for ASMPT since 2020, primarily introducing ASMPT's die bonders and various back-end equipment to domestic customers. We also provide continuous engineering support after the equipment installation. Features of ASMPT: - A wide range of back-end equipment handling, from plating solutions to dicing, die bonding, wire bonding, molding, and SMT. - Global track record of installations. - Continuous investment of 10% of total sales into equipment research and development. - Provision of engineering support both domestically and internationally. - Particularly strong lineup in die bonding equipment, offering a wide range of equipment proposals.
basic information
Main Products Handled by ASMPT 〇 Laser Dicing Equipment: Multi-laser dicing using patented technology. High-speed dicing without damaging the wafer. 〇 Die Bonding Equipment: Handling high-speed machines, high-precision machines, and various bonding methods with widths from 0.2μm to 25μm. - Ultra-High Precision Die Bonder (Flip): Alignment with a maximum precision of 0.2μm. - Clip Bonder: Flexible pickup functionality. - Soft Solder Bonder: Solder dispensing method using patented technology. - Multi-Chip Bonder: Bonding multiple types of chips onto a single substrate in one pass. - High-Speed Eutectic Bonder: Precision of 7μm with mirage prevention during heat-up. - 12-Inch Wafer Compatible Bonder: Equipped with rich inspection features. - Bonder for Advanced Packages: TCB, pick and place, hybrid bonder. - Sorter: Ultra-fast sorting. - Mass Bonder: Bulk bonding of multiple types of chips. 〇 Wire Bonder: High-speed bonding using patented technology. 〇 Sintering Equipment: Press method using patented technology. - Die Tacking Equipment: Flexible tacking.
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Applications/Examples of results
LiDAR, vehicle-mounted LED, LED display, MiniLED/MicroLED, CMOS image sensor, sintering, EV, power package, IC discrete, silicon photonics, 5G, data center, smart glasses, advanced package 2.5D/3D, hybrid bonder, memory, MEMS, wearable products, RFID, crystal oscillator, optical communication, IC power-related, MEMS sensor, etc.
