ASMPT manufactured MEGA DA multi-chip compatible bonder NEW
Multi-chip die bonder
The company's device is a customizable multi-chip die bonder that can be adjusted according to accuracy, bonding method, and cycle time. It can mount multiple types of chips on a single substrate, with a selectable accuracy range of ±2µm to ±25µm. By using options, it is possible to change the accuracy, bonding method, and cycle time. (Once the accuracy, bonding method, or cycle time has been changed, it cannot be modified again.)
basic information
【Main Specifications】 - Alignment Accuracy: ±2µm to ±25µm - Cycle Time: 14K max - Die Size Compatibility: 0.15 x 0.15 – 10 x 10 mm (Option for 0.05 x 0.1 mm Die Size Handling) - Substrate Size Compatibility: Width 50 – 130 mm, Length 100 – 300 mm, Thickness 0.5 – 5 mm - Wafer Input: Up to 12 inches - Bonding Method: Epoxy/UV Curing 【Product Features】 - Multi-chip compatibility - Dispenser: Up to 3 units can be installed (3rd unit optional) - Multi-bond head collet, multi-pickup collet, multi-ejector, multi-input (wafer, gel pack, waffle pack, etc.) - 3D inspection function for epoxy - Suitable for small batch, diverse products, mass production, and R&D use
Price information
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Delivery Time
Model number/Brand name
MEGA DA
Applications/Examples of results
3D Sensing、Telecom、Data Center、General LED Lightings & RGB Display、Automotive
