ASMPT manufactured die bonder Photon Pro
Multi-Wafer Handling Die Bonder (Auto)
The company's equipment is a die bonder that achieves high precision and high throughput for mass production.
basic information
Alignment accuracy: ± 3 µm @ 3 σ Throughput: 3 seconds/Chip Load (bond force): 10 – 250 g Implemented applications: various optical transceivers & sensor packages (TOSA, ROSA, Mechanical Optical Interface (MOI), 3D sensor, inertial sensor, etc.) Bonding method: epoxy resin Others: multi-wafer handling compatible Options: flip chip compatible, waffle pack and gel pack supply compatible
Price information
Please contact us each time.
Delivery Time
Model number/Brand name
Photon-Pro
Applications/Examples of results
various optical transceivers & sensor packages (TOSA, ROSA, Mechanical Optical Interface (MOI), 3D sensor, inertial
