ASMPT's ultra-high precision flip chip bonder 'NANO Pro'
Achieved alignment accuracy of ±0.2μm. Extensive track record of implementation, primarily in optical communication and silicon photonics.
The "NANO Pro" is a bonding device that uses ASMPT's patented alignment technology to bond diced chips to wafers, substrates, and chips with ultra-high precision of ±0.2μm. It employs laser bonding, achieving localized heating and a high-speed temperature profile during the bonding process. It also features mechanisms to suppress vibrations during bonding and from external sources. 【Main Specifications】 ■ Alignment Accuracy: ±0.2μm@3σ ■ Cycle Time: 18 seconds (varies by material) ■ Die Size: 0.1mm to 25mm ■ Substrate Size: MAX 300×300mm ■ Bonding Force (Load): 3g up to 2000g ■ Bonding Methods: Eutectic solder, epoxy, UV-curable resin, laser bonding 【Adoption Results】 ■ Optical communication ■ Silicon photonics ■ R&D and mass production facilities ■ MEMS sensors, LiDAR, VCSELs, etc. *For more details, please feel free to contact us.
basic information
ASMPT's flip chip/die bonder offers alignment accuracy ranging from 0.2μm to 25μm, with cycle times from 18 seconds to 0.16 seconds. We can recommend die bonders based on the size of the die and substrate, as well as the bonding method. In addition to die bonders, we have a wide range of backend equipment, including laser dicing machines, wire bonding machines, AOI equipment, molding machines, and sintering machines. *Please feel free to contact us if you are looking for die bonders or backend equipment.*
Price information
Please contact us.
Delivery Time
Model number/Brand name
NANO Pro
Applications/Examples of results
MicroLED, Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP, MTP etc.
