ASMPT manufactured flip chip bonder/die bonder AFCPlus
AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.
"AFC Plus" is a device that enables bonding of high-precision, diced chips to wafers/substrates/dies using the company's patented alignment technology. 【Features】 - Alignment accuracy: ±1µm @ 3s - Alignment technology (patented) - Bonding methods during the joining process - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding *Ultrasonic bonding is not supported.
basic information
Described in the catalog materials.
Price range
Delivery Time
Applications/Examples of results
Micro optics, LED and MEMS assembly, semiconductor advanced packaging (3D, stack die, etc.)
