ASMPT manufactured flip chip bonder - Novaplus
Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.
"Nova plus" is a device that enables bonding of high-speed diced chips to wafers/substrates/dies using the company's patented alignment technology. It is also equipped with a dual bond head. 【Features】 - Alignment accuracy: ±2.5μm @ 3σ - Alignment technology (patented) - Joining methods during bonding - Equipped with dual bond head - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±2.5μm @ 3σ - Cycle time: 1.5 to 6 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 600 x 600 mm - Bonding force (load): 10g to 5kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported - Option: For upgrade kit specifications, accuracy ±1.5 µm @ 3σ
basic information
Described in the catalog materials.
Price range
Delivery Time
Applications/Examples of results
Applications: Semiconductor advanced packaging, MEMS, Automotive Sensors, RFID, LED, Optoelectronic
Detailed information
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■Slim-type transmitter Waterproof design for peace of mind. Can be mounted on a wall and linked with external switches. Colors (Gray, Black, Pearl Black, Marble Gray, Wood Grain)
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■Single-sided/Dual-sided Reception Display Device Displays the called number in order of priority. There are red and green displays, which are used differently depending on the application.
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■Number Eraser You can arbitrarily erase the number displayed in the frame on the receiving display. There is also a "Clear All" button that allows you to erase all displayed numbers at once.
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■Mobile Receiver LED Type Staff will carry it. It's convenient because you can see when you're being called at hand. It notifies you with a vibration.
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■Card-type transmitter It takes up little space and can be mounted on walls or hung with wires. Being card-shaped, it doesn't get in the way.
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Our company started in 1982 as a technical trading company specializing in the sales and maintenance services of semiconductor manufacturing equipment imported from overseas, as a group company of Kanematsu Corporation. Recently, in order to meet the diverse needs of our customers, we have been committed to ensuring that not only manufacturing equipment but also overseas products such as parts, materials, and subsystems can be used with confidence by our customers. While being a trading company, we have enhanced our technical department, which is responsible for planning, development, design, and manufacturing, to propose comprehensive technical solutions and expand our business globally to customers both domestically and internationally. In the future, we aim to continue being a company that provides new added value and services as an electronics technology trading company, growing together with our customers.