2025 Yokohama Automotive Technology Exhibition Participation

積水テクノ成型新事業開発部

We will be exhibiting at the 2025 Automotive Technology Exhibition. We will showcase "Heat Dissipation and Electromagnetic Shielding Resin Molded Products." If you have time, we would be delighted if you could stop by our booth. We will provide explanations while you can touch the actual products. Please see below for details. 【2025 Automotive Technology Exhibition】 https://aee.expo-info.jsae.or.jp/ja/yokohama/ 　Exhibition Dates: 　　May 21, 2025 (Wed) 10:00 AM - 6:00 PM 　　May 22, 2025 (Thu) 10:00 AM - 6:00 PM 　　May 23, 2025 (Fri) 9:00 AM - 4:00 PM 　Venue: 　　Pacifico Yokohama Exhibition Hall, North 　Booth Location: 　　Exhibition Hall 351 (within the Sekisui Chemical booth) *For exhibition and registration information, please visit here: 　https://aee.expo-info.jsae.or.jp/ja/registinfo/

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Related product information

Contributing to Sekisui's development products [heat dissipation, EMC, and weight reduction measures]!
Developed a resin that balances heat dissipation and electromagnetic wave shielding! Achieved approximately 45% weight reduction by converting from metal to resin.

■Thermal Conductive Resin Molding Products - Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) - Achieving high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat Dissipation and Electromagnetic Wave Shielding Resin Molding Products - Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) - Achieving electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω
Lightweighting and cost reduction through the use of plastics around automotive ECUs [ECM measures].
Currently, metal housings/cases are mainstream for vehicle-mounted ECUs. By changing this to resin, weight reduction and cost savings can be achieved.

■Thermal Conductive Resin Molding Products ・Realization of high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) ・Realization of high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat Dissipation and Electromagnetic Wave Shielding Resin Molding Products ・Realization of high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) ・Realization of electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω
Injection-molded resin optimal for heat dissipation and EMC measures for various EV-related automotive components.
If it is a heat-dissipating and electromagnetic wave shielding resin molded product, EMC measures essential for e-Axle and on-board chargers (OBC) can also be achieved.

■Heat dissipation and electromagnetic wave shielding resin molded products ・Realization of high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) ・Realization of electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω
Vehicle-mounted camera and millimeter-wave radar housings made of resin that can counter ECM measures.
Proposal for resin molded products that ensure heat dissipation and electromagnetic wave shielding performance for vehicle-mounted cameras, millimeter-wave radar, and LiDAR housings.

■Heat-conducting resin molded products ・Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) ・Achieving high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat dissipation and electromagnetic wave shielding resin molded products ・Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) ・Achieving electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω
Company brochure, product development introduction video, completed!
The company profile and product development introduction video have been released.

　
Promotional video [Heat dissipation and electromagnetic wave shielding resin molded products]
The video of the heat dissipation and electromagnetic wave shielding resin molded products has been completed.

■Thermal Conductive Resin Molding Products ・Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) ・Achieving high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat Dissipation and Electromagnetic Wave Shielding Resin Molding Products ・Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) ・Achieving electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω
Thermal conduction molded products
Heat dissipation performance closer to metal materials than general-purpose resins! Proposing material and product design tailored to the quality requirements of various products.

For more details, please refer to the PDF document or feel free to contact us.