積水テクノ成型 新事業開発部 Official site

Developed a resin that balances heat dissipation and electromagnetic wave shielding! Achieved approximately 45% weight reduction by converting from metal to resin.

■Thermal Conductive Resin Molding Products - Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) - Achieving high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat Dissipation and Electromagnetic Wave Shielding Resin Molding Products - Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) - Achieving electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω

Currently, metal housings/cases are mainstream for vehicle-mounted ECUs. By changing this to resin, weight reduction and cost savings can be achieved.

■Thermal Conductive Resin Molding Products ・Realization of high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) ・Realization of high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat Dissipation and Electromagnetic Wave Shielding Resin Molding Products ・Realization of high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) ・Realization of electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω

If it is a heat-dissipating and electromagnetic wave shielding resin molded product, EMC measures essential for e-Axle and on-board chargers (OBC) can also be achieved.

■Heat dissipation and electromagnetic wave shielding resin molded products ・Realization of high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) ・Realization of electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω

Proposal for resin molded products that ensure heat dissipation and electromagnetic wave shielding performance for vehicle-mounted cameras, millimeter-wave radar, and LiDAR housings.

■Heat-conducting resin molded products ・Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) ・Achieving high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat dissipation and electromagnetic wave shielding resin molded products ・Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) ・Achieving electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω

The video of the heat dissipation and electromagnetic wave shielding resin molded products has been completed.

■Thermal Conductive Resin Molding Products ・Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) ・Achieving high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat Dissipation and Electromagnetic Wave Shielding Resin Molding Products ・Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) ・Achieving electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω

Heat dissipation performance closer to metal materials than general-purpose resins! Proposing material and product design tailored to the quality requirements of various products.

For more details, please refer to the PDF document or feel free to contact us.