澁谷工業 メカトロ統轄本部 Official site

Carbon Dioxide Laser Processing Machine "Musashi HP-E Series"

The processing area is 1250x1250mm! A space-saving, compact design CO2 laser processing machine.

The "Musashi HP-E Series" is a carbon dioxide laser processing machine designed for thin plates and small workpieces. Various laser oscillators (rated output of 200, 400, and 2000W) can be selected according to the processing requirements. It features a space-saving, compact design and employs a processing table with excellent accessibility. 【Features】 ■ Compatible with thin plates and small workpieces ■ Various laser oscillators can be selected according to processing requirements ■ Space-saving, compact design ■ Processing table with excellent accessibility *For more details, please refer to the related links or feel free to contact us.

Related Link - https://www.shibuya.co.jp/cutting/las_hp.html

basic information

【Specifications (Partial)】 ■Model: SPL3712EA / SSL250B ■Equipped Oscillator: SSL250B ■Rated Output: 200W ■Processing Area: 1250x1250mm ■Maximum Load Capacity: 40kg (4'x4'x3.2t) ■Fast Feed Speed: 30m/min ■Number of Control Axes: 3 axes (X, Y, Z) ■Number of Simultaneous Control Axes: 2 axes (X, Y) *For more details, please refer to the related links or feel free to contact us.

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Model number/Brand name

"Musashi HP-E" SPL3712EA model

Applications/Examples of results

For more details, please refer to the related links or feel free to contact us.

Line up(3)

Model number overview
SPL3712EA/SSL250B Rated output 200W Processing area 1250×1250mm
SPL3712EA/SSL400 Rated output 400W Processing area 1250×1250mm
SPL3712EA/SOL20V Rated output 2000W Processing area 1250×1250mm

Laser processing machine lineup

PRODUCT

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Distributors

Our company is headquartered in Kanazawa City, Ishikawa Prefecture, and has sales offices and factories both within and outside the prefecture. We focus on the bottling business, which involves filling beverages and other products, and we are expanding into various fields such as solid-liquid mixing and dispersion systems, laser processing machines (including fiber lasers and CO2 lasers), and semiconductor assembly equipment (such as taping machines, multifunctional test handlers, ball mount machines, and bonders). Please feel free to contact us if you have any inquiries.