Semiconductor assembly system
Semiconductor assembly system
With the advancement of science and technology, semiconductor products are increasingly required to have high-density packaging. Shibuya manufactures various devices aimed at streamlining and rationalizing semiconductor manufacturing lines, including test handlers for ICs and LEDs, taping machines, solder ball mount machines, and various types of bonders. Additionally, we also produce a LiB electrode material slurry manufacturing system that slurries the raw materials for lithium-ion batteries.
1～13 item / All 13 items
-
High-speed mass production ball mount SBM371
Solder balls can be rapidly mounted in bulk on BGA substrates, connectors, and more. There is also a track record of mounting solder balls on items other than substrates.
last updated
-
Mass production micro ball mounter SBP662
Mass production micro ball mounter compatible with up to 12-inch wafers.
last updated
-
Small-scale production and development die bonder / flip chip bonder DB258
The flip chip bonder is ideal for small-scale production and development, perfect for high-precision assembly required for optical devices and more.
last updated
-
High-precision die bonder / flip chip bonder FDB210 / 211
It is a high-precision die bonder optimized for mass production of optical devices. Additionally, we also offer the highly precise FDB210P in our lineup.
last updated
-
Taping machine (High-speed inspection taping machine ETM520)
It is a high-speed inspection taping machine. By adopting a disc-type indexing unit, it achieves high-speed work transport.
last updated
-
Taping machine (High-speed inspection taping machine ETM486)
This is a high-speed inspection taping machine for high-frequency semiconductors and SMDs. It can support simultaneous measurement, appearance inspection, marking, and more, depending on the options.
last updated
-
Taping Machine ETM460
It is a standard and high-speed taping machine. Automatic repair functions and a simple measurement station can also be added.
last updated
-
Micro Ball Mount SBP551
This is a micro ball mounter that performs flux printing and ball mounting in bulk on PLP and BGA substrates.
last updated
-
Ultra High Precision Bonder FDB210P
It is a super high-precision die bonder optimized for mass production of optical devices.
last updated
-
LED Taping Machine
High-speed inspection taping machine compatible with inspection mechanisms required for LEDs.
last updated
-
LED Taping Machine
A standard taping machine equipped with an inspection mechanism required for LEDs.
last updated
-
LED Test Handler (Inspection Classifier) EH165
High-speed classifier for small LED devices: High-speed processing of optical inspection, electrical characteristic inspection, and classification; compatible with various sizes through attachment exchange.
last updated
-
Taping machine for large parts
Taping machine for metal parts and module parts
last updated