半導体組立システム
半導体組立システム
科学技術の進歩とともに、ますます高密度実装が求められる半導体製品。シブヤではICやLEDなどのテストハンドラ、テーピングマシンをはじめ、ハンダボールマウンタや各種ボンダなど、半導体製造ラインの省力化、合理化を図る各種装置を製作しています。 また、リチウムイオン電池の原料をスラリー化するLiB電極材スラリー製造システムも製作しています。
1～9 件を表示 ／ 全 9 件
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High-speed mass production ball mount SBM371
Solder balls can be rapidly mounted in bulk on BGA substrates, connectors, and more. There is also a track record of mounting solder balls on items other than substrates.
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Mass production micro ball mounter SBP662
Mass production micro ball mounter compatible with up to 12-inch wafers.
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Small-scale production and development die bonder / flip chip bonder DB258
The flip chip bonder is ideal for small-scale production and development, perfect for high-precision assembly required for optical devices and more.
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High-precision die bonder / flip chip bonder FDB210 / 211
It is a high-precision die bonder optimized for mass production of optical devices. Additionally, we also offer the highly precise FDB210P in our lineup.
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Taping machine (High-speed inspection taping machine ETM520)
It is a high-speed inspection taping machine. By adopting a disc-type indexing unit, it achieves high-speed work transport.
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Taping machine (High-speed inspection taping machine ETM486)
This is a high-speed inspection taping machine for high-frequency semiconductors and SMDs. It can support simultaneous measurement, appearance inspection, marking, and more, depending on the options.
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Taping Machine ETM460
It is a standard and high-speed taping machine. Automatic repair functions and a simple measurement station can also be added.
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Micro Ball Mount SBP551
This is a micro ball mounter that performs flux printing and ball mounting in bulk on PLP and BGA substrates.
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Ultra High Precision Bonder FDB210P
It is a super high-precision die bonder optimized for mass production of optical devices.
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