Small-scale production and development die bonder / flip chip bonder DB258
The flip chip bonder is ideal for small-scale production and development, perfect for high-precision assembly required for optical devices and more.
This machine is a high-precision semi-automatic flip chip bonder suitable for experiments, development, and small-scale production. With a digitally adjustable pulse heat stage and various options, it can handle a wide range of assembly processes with just this one unit.
basic information
Main Features ■ Compatible with microchips (0.25mm and above) (Option: 0.15mm and above) ■ High precision mounting achievable at ±2μm (3σ) High precision positioning is achieved through a high-rigidity frame and fully closed-axis control, along with an automatic calibration function that ensures stable mounting accuracy. ■ Supports various processes Broad compatibility with processes such as eutectic bonding and resin bonding, equipped with monitoring functions after mounting, making process control easy. Options ■ Ultrasonic head ■ Resin transfer mechanism ■ Multi-chip compatibility ■ N₂ purge mechanism ■ Device inversion head ■ Face-up mounting capability ■ High load head (up to 50Kgf)
Price range
Delivery Time
Model number/Brand name
DB258
Applications/Examples of results
Flip chip mounting, experimentation, evaluation, sample creation High-precision die bonding implementation
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Our company is headquartered in Kanazawa City, Ishikawa Prefecture, and has sales offices and factories both within and outside the prefecture. We focus on the bottling business, which involves filling beverages and other products, and we are expanding into various fields such as solid-liquid mixing and dispersion systems, laser processing machines (including fiber lasers and CO2 lasers), and semiconductor assembly equipment (such as taping machines, multifunctional test handlers, ball mount machines, and bonders). Please feel free to contact us if you have any inquiries.