High-speed mass production ball mount SBM371
Solder balls can be rapidly mounted in bulk on BGA substrates, connectors, and more. There is also a track record of mounting solder balls on items other than substrates.
This machine is a system that performs high-precision positioning using image processing to mount solder balls on PLP/BGA/CSP substrates. It supports not only bulk mounting by frame units but also simultaneous mounting of multiple individual substrates through optional features. It is also possible to propose a consistent line that includes the connection of inspection machines and peripheral devices such as mounters, reflow ovens, and cleaning machines. There is also a high demand for solder ball mounting on substrates with irregular shapes, such as connectors, and we provide system proposals from development to mass production.
basic information
Main Features ■ Compatible with micro balls (φ0.15mm and above) ■ Bulk processing of substrates Flux transfer and ball mounting are possible for areas up to a maximum of 90×290mm. ■ Stable ball mounting Stable ball mounting is possible on warped substrates due to our unique pin transfer method for flux transfer. It is also compatible with stepped lands. ■ Supports multiple individual substrates mounting (optional) ■ We can provide a full line system including inspection systems and reflow ovens.
Price range
Delivery Time
Model number/Brand name
SBM371
Applications/Examples of results
For mounting solder balls for BGA/CSP.
