Ultra High Precision Bonder FDB210P
It is a super high-precision die bonder optimized for mass production of optical devices.
This machine is a high-precision bonder for the production of optical communication modules/optical devices suitable for mass production. It also supports flip-chip mounting. It enables ultra-high-precision mounting of microchips on supplied substrates using a two-point recognition method. It is a compact device that integrates chip/substrate supply and finished product storage. Shibuya Kogyo has many years of experience in optical communication modules and optical devices. The FDB210P is one of the devices that incorporates years of know-how.
basic information
Main Features ■ Compatible with microchips (0.25 mm and above) (Option: 0.15 mm and above) ■ High precision mounting achievable at ±0.7 μm (3σ) High precision positioning is realized through a high-rigidity frame and fully closed-axis control, along with an automatic calibration function that ensures stable mounting accuracy. ■ Supports various processes Broad compatibility with processes such as eutectic bonding and resin bonding, equipped with monitoring functions post-mounting, making process control easy. Options ■ Ultrasonic head ■ Multi-chip support ■ N₂ purge mechanism ■ Face-up mounting capability
Price range
Delivery Time
Model number/Brand name
FDB210P
Applications/Examples of results
High-precision die bonder High-precision flip chip bonder For COC and COS process implementation in optical device and laser module manufacturing Supports eutectic bonding, resin bonding, and more
