Testing for the sheet-type plasma reflow device (fluxless reflow) is now open.
Fluxless wafer bump reflow device. Achieves fine bump reflow without wet processes. Sample demo available. Reflow video posted.
basic information
Charge-up damage-free process. Highly reliable and stable transport mechanism. Reflow temperature profile on a 300mm wafer with uniform temperature distribution. Supports full-scale mass production lines for 300mm wafers. Compatible with various upper communication standards, SMIFF pods, etc. Consistent team support from testing to design, delivery, and startup.
Price information
Please contact us.
Delivery Time
Model number/Brand name
CtoC type plasma reflow device
Applications/Examples of results
Wafer bump reflow Fine bump reflow on large substrates 300mm wafer single-sheet low-temperature annealing
Detailed information
Related Videos
Line up（1）
| Model number | overview |
|---|---|
| Batch-type plasma flow device | Batch type compatible with 300mm wafers, deploying cutting-edge processes for niche devices. For R&D and small-scale production. |
