Polyimide cure device (300mm wafer compatible clean bake device)
300mm wafer-compatible polyimide cure, baking, low-temperature annealing, compatible with multilayer substrates. Thermal processing equipment for mass production of advanced electronic devices.
High uniformity hot air heating in a low oxygen atmosphere (N2) after vacuum replacement. Heating treatment of 300mm wafers in cassette units. Compatible with system LSI polyimide curing and flexible printed circuit board curing/annealing. Achieving both high quality and mass production with curing of 300mm wafer cassette units.
basic information
Heating with hot air in a low-oxygen atmosphere. Achieving both temperature uniformity and cleanliness. A highly reliable device with extensive adoption records in mass production lines for advanced devices. Supports a wide range of applications, including not only polyimide curing for semiconductors but also flexible substrate baking and solar cell annealing. Available in a high vacuum type as an option. Compatible with high-temperature processing types. Also includes a quartz tube type CtoC suitable for wafer processes in the lineup.
Price information
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Delivery Time
Applications/Examples of results
System LSI polyimide cure. High-density mounting substrate polyimide cure. Flexible substrate bake, solar cell anneal.
