Standard Batch Type Sputtering Device (SRV Series)
Multi-functional, compact, flexible support, a standard lineup with proven results and trust.
A standard batch-type sputtering series that incorporates a three-element cathode into a compact housing. It covers the film deposition process for various electronic devices and related materials from basic development to mass production, thanks to a wide uniform range of film thickness distribution and an automatic control mechanism. Our film deposition processes and options, supported by numerous delivery records, will reliably meet your requirements.
basic information
The series is basically a batch type equipped with 4-inch, 6-inch, and 8-inch cathodes (standard with three types each). Each has an effective film formation area that is more than double the area of the cathode. The sputtering direction (up or down) can also be selected according to the purpose, and larger cathodes other than the standard type can be installed to match the chamber size. Different types of cathodes can be selected according to the film type, including those for ferromagnetic materials and conventional types. Additionally, various mechanisms such as high-temperature heating, substrate cooling (water cooling), and multi-target simultaneous sputtering are available to accommodate a wide range of applications.
Price information
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Delivery Time
Model number/Brand name
SRV4310 type
Applications/Examples of results
Compound semiconductor research and development Electrode formation and protective film formation Electronic components (thin film resistors, sensors) Thin film resistor formation, electrode formation, sensor film formation, protective film formation Precision machinery field Lens mold protective film formation Material field Research and development of new materials, resin surface modification (metalization, barrier films, optical films) formation
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Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.