Ultra-High Vacuum Sputtering Equipment (Model STM2323)

Ideal for research and development of advanced thin film devices. A customizable single-sheet ultra-high vacuum inline system. Responding to demands with a wealth of options and flexible support.

A super high vacuum sputtering device with exhaust performance of 10⁻⁷ Pa. It is equipped with a cassette chamber, transfer chamber, etching chamber, and multiple sputtering chambers in a standard configuration. It achieves efficiency in research and development work through fully automated operation using a fully automatic CtC method. You can also choose deposition mechanisms such as high-efficiency ferromagnetic cathodes and wide erosion cathodes, and we can accommodate individual requirements based on substrates and purposes. It can also support a simple device configuration, achieving reasonable cost solutions. As an advanced specification, a cluster-type transfer chamber can be equipped, and it is an evolved sputtering device capable of incorporating different process chambers such as annealing and deposition.

basic information

Standard inline type Standard 6-chamber configuration (load lock chamber, cassette chamber, transport chamber, 3 sputter chambers) Sheet-type CtC system Achievable pressure: 10⁻⁷ pa Order (sputter chamber) Target substrate: φ2 to 4 inches Optional features High-efficiency ferromagnetic cathode, substrate magnetization mechanism, etching chamber Customization support