Mass production compatible batch-type sputtering system (Model STH10311)
A batch-type sputtering device equipped with four substrate holders for φ410 substrates, achieving excellent film thickness uniformity within ±5% in the same substrate holder.
This is a batch-type sputtering device that achieves both processing capacity for mass production and excellent film thickness uniformity by adopting multiple self-rotation substrate stages. Despite being a chamber system exceeding 1 meter due to the side sputtering method, it enables easy attachment and detachment of substrates and targets, as well as simplified maintenance within the vacuum chamber. It incorporates essential considerations for mass production equipment, such as a data logging system optimal for mass production and control interface software that facilitates device control and management. It balances quality and throughput for large substrates represented by 300 mm wafers, as well as for the mass production of small electronic components like resistors and sensors.
basic information
Device Configuration Parallel Plate Side Sputtering Device Cathode: Rotary Magnetron Cathode 3-Element Compatible Substrates: Flat substrates up to φ410 Cathode Power Supply: DC and RF Included Mechanisms: Substrate Heating Mechanism, Reverse Sputtering, Bias Sputtering Mechanism Optional Mechanisms: Simultaneous Sputtering Mechanism CtoC Conversion, Inline Configuration
Price information
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Delivery Time
Model number/Brand name
Model STH10311
Applications/Examples of results
Formation of UBM layer in semiconductor packaging Mass production of compound semiconductors (electrode formation) Mass production of resistors Mass production of MEMS sensors
