Compound semiconductor deposition device (AAMF-C1650SPB type)
A dedicated deposition device optimal for advanced optical devices. Achieves a smooth film surface with low-temperature, low-damage film formation. High-quality electrode films realized by hardware compatible with ultra-high vacuum.
A large-diameter cryopump has been adopted in a more compact chamber than conventional types, and ultra-high vacuum compatibility has been implemented in each mechanism of the chamber, enabling a clean high-vacuum environment. The evaporation source uses an electron gun with a water-cooled reflective electron trap, achieving low-damage film formation that prevents electron bombardment on the substrate. The well-established six-gun electron gun is compatible with the formation of multilayer film electrodes that include high-melting-point metals. It features stable deposition, eliminating substrate damage from micro-arcs and abnormalities on the film surface caused by droplets. It can also accommodate lift-off deposition according to the process and production volume. During lift-off deposition, a water-cooling mechanism from the back of the substrate compatible with thick-film electrodes allows for the formation of precious metal thick-film electrodes.
basic information
Batch-type high vacuum deposition system equipped with a 6-beam electron gun and a mobile multi-resistance heating evaporation source. The chamber diameter has been compacted to accommodate small-diameter wafers, compared to standard wafer process-compatible deposition systems. It allows for the switching use of a vertical deposition rotating dome for lift-off processes and a three-sided planetary self-rotating dome for large-scale processing. It comes standard with a substrate heating heater, enabling a wide range of fully automated operations and data logging via a touch panel, along with substrate baking before film formation, ensuring stable operation. There are also many optional features available, such as substrate water cooling mechanisms, high-temperature heating mechanisms, simultaneous deposition mechanisms, and load-lock mechanisms, which can be selected according to specific needs based on proven mechanisms.
Price information
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Delivery Time
Model number/Brand name
AAMF-C1650SPB model
Applications/Examples of results
Formation of electrodes for optical communication laser devices Formation of electrodes for infrared laser devices Formation of electrodes for microwave ICs Formation of electrodes for MEMS devices and various thin films
