Conductive carbon thin film formation device (arc discharge sputtering device)
Conductive carbon thin films are formed by sputtering. Stable film formation is achieved through a simple process with inert gas and carbon target at low temperatures (below 400°C).
Using the independent high-density sputtering method, conductive carbon thin films are formed through a process equivalent to metal film deposition via arc discharge magnetron sputtering (ADMS method). Compared to conventional sputtered carbon thin films, these films are characterized by significantly higher density and adhesion. Due to their conductive properties and film stability, they are suitable for new fields such as energy and biosensors. Conductive carbon thin films excel in hardness and surface smoothness, making them applicable for surface treatment of mechanical parts (tribological applications) due to their high adhesion to metals.
basic information
Equipped with a uniquely developed arc discharge type magnetron cathode. Capable of forming not only conductive carbon thin films but also various reaction films (nitride films, oxynitride films). The arc discharge type magnetron cathode also supports ion etching and nitriding of substrates before film formation. The multi-cathode allows for the layered deposition of an adhesion layer and conductive carbon film tailored to the substrate. Supports new material development, such as the addition of metals to conductive carbon films through simultaneous sputtering. Offers two models: a large batch type for surface treatment with a proven basic chamber configuration and a compact type for R&D.
Price information
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Delivery Time
Applications/Examples of results
For new device R&D Surface treatment for machine parts
