Hydrogen atmosphere conveyor furnace (reduction atmosphere continuous heat treatment device)
A bestselling type with a wealth of achievements, supporting high-temperature soldering, paste sintering, and metal particle sintering processes with reliable software and highly dependable hardware.
Replacement of the atmosphere in the furnace with hydrogen reduction. Achieving low oxygen concentration and reduction atmosphere treatment that cannot be realized with an inert atmosphere using N2 through continuous processing in a conveyor furnace. Utilizing the reduction effect of the hydrogen atmosphere, it supports high-temperature soldering and continuous reduction atmosphere heat treatment that require high reliability, which cannot be addressed by conventional reflow. There is also a wealth of experience in firing various pastes. The system covers the reflow process for wafer bumps of system LSI with a CtC type compatible with 300 mm wafers. In addition to conventional soldering, brazing, and paste firing processes, it also has a proven track record in sintering bonding for next-generation bonding materials (metal nano-paste). A demonstration machine is permanently available to reliably support initial tests for various applications through to mass production.
basic information
Supports a range from a compact machine with a belt width of 200 mm to a full-scale production type of 600 mm. The heating temperature lineup includes soldering types with a regular use temperature of 350°C (maximum 450°C) and multi-purpose types with a maximum of 900°C. It also supports atmosphere gases including N2. A clean type with an internal class of 100 or below is available as an option. A demonstration machine is permanently installed in-house to support the process from initial testing.
Price information
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Applications/Examples of results
High-temperature soldering of electronic components Sintering bonding of power device metal nanoparticles Soldering of connection terminals Firing of various pastes Wafer bump reflow
