R&D Multi-Chamber Sputtering Device
Specialized for responding to R&D and niche processes, a new type of multi-chamber sputtering device for small-scale production and prototyping/research and development, which is difficult with mass production equipment.
A low-cost multi-chamber sputtering system dedicated to the development of advanced thin film processes and small-scale production. It accommodates a wide range of fields with a high-efficiency cathode that excels in film thickness control and a variety of optional mechanisms. Proven in various processes, not only for Si semiconductor electrodes and wiring films but also for magnetic films, insulating films, and protective films for micro-magnetic devices and MEMS. It features the ability to equip different process chambers such as evaporation, annealing, and CVD, allowing for full custom-made production that freely connects each process chamber to a proven mainframe (transport system).
basic information
Features flexible compatibility for standard diameter wafers up to 8 inches and rectangular substrates up to 6 inches. Dedicated transport trays enable substrate transport and film deposition for small-diameter wafers and irregular substrates. In metal film deposition, we provide detailed support from R&D to mass production, including wiring, electrode films, sensor films for thin-film magnetic devices, protective films, and piezoelectric films for MEMS sensors.
Price information
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Delivery Time
Model number/Brand name
STM Series
Applications/Examples of results
Silicon semiconductor research and development Compound semiconductor research and development / mass production Semiconductor packaging process (UBM) mass production High-density mounting substrate mass production MEMS device prototyping and mass production
