ALN coating device (high-density plasma sputtering ADMS device)
Forming crystalline AlN films with high-density plasma sputtering, compatible with full coating on three-dimensional shapes. Fully automated mass production equipment lineup.
A high-density plasma sputtering method developed in-house, the ADMS method (arc discharge type magnetron sputtering), enables the deposition of a dense AlN film on three-dimensional substrates, unlike anything seen before. It achieves a high-density plasma sputtering with ten times the amount of ions compared to conventional methods. With a unique high-reactivity sputtering process, crystalline AlN is formed at low temperatures below 500°C. This new thin-film formation device creates new surface functions for everything from electronic devices to mechanical parts.
basic information
The conventional hard film ADM system compatible with three-dimensional hairy substrates (mechanical parts, jigs, and molds) can be equipped with a cathode for AlN film and process software. It achieves high deposition rates for three-dimensional shaped products instead of flat substrates like wafers and ceramics. A fully automated mass production system with high reliability is available in the lineup.
Price information
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Applications/Examples of results
Semiconductor manufacturing equipment parts - electrostatic chucks Ceramic surface treatment Heat sinks - insulating substrates Jigs and tools - molds, etc.
