Hydrogen Plasma Cleaning Device (Ion Cleaning Type)

H2 (Surface cleaning of various substrates using the reducing power of hydrogen plasma. Improved hydrophilicity and wettability due to the removal of surface oxide layers. A new surface cleaning technology using dry, room temperature treatment.)

A new type of multi-purpose plasma cleaning device with a proven track record has arrived. In addition to the conventional surface cleaning function using plasma, it now features a reduction cleaning function using hydrogen plasma. The ability to remove surface oxide layers has significantly improved, and the hydrophilicity of substrates after cleaning has greatly increased. It also supports conventional plasma cleaning as before. Furthermore, with new cleaning functions such as combined cleaning with traditional Ar plasma cleaning and two-step cleaning with O2 (oxygen) cleaning, the cleaning targets and effectiveness have been greatly enhanced compared to general plasma cleaning. This new plasma cleaning device can accommodate everything from small-scale to full-scale production lines.

basic information

Plasma cleaning equipment for implementation substrates "POEM" and the hardware of mass production plasma cleaning equipment have been applied, and the cleaning gas and process recipes have been upgraded. Achieving purpose-specific cleaning processes with a wealth of recipes. In addition to high-reduction cleaning using hydrogen gas alone, MIX cleaning with physical cleaning/reduction cleaning using a mixed gas of Ar + H2. STEP cleaning with surface reduction cleaning (removal of surface oxide layers) using H2 plasma cleaning after organic matter removal by O2 cleaning. Balancing the physical cleaning effect of plasma ions and the reduction capability of hydrogen. A new dry cleaning device with effects not seen before.