Large plasma etching device
Batch-type etching equipment with extensive experience in etching and ashing of wafers, glass, and large substrates. Also compatible with semiconductor manufacturing equipment parts and materials.
Based on the highly successful batch-type plasma etching system "EXAM," the stage has been expanded to accommodate a maximum diameter of 600 mm or 500 mm square. The large stage supports a wide range of processes, including fine-pitch etching, ashing of various organic materials, surface modification, and cleaning. Similar to the conventional model EXAM, it performs etching on wafers, glass, and ceramic substrates, and has extensive experience in etching, cleaning, and surface treatment of large mounted substrates and pre-cut film substrates. This new dry process tool is also optimal for processing large products that require cleanliness and delicate surface treatment, such as semiconductor manufacturing equipment parts and materials, in addition to electronic devices.
basic information
A batch-type parallel plate plasma etching device equipped with a standard 500 mm square stage. It features high-frequency plasma as standard and can switch between RIE and plasma etching modes. Etching and ashing using F-type gases are standard processes, supporting etching and ashing of Si-based, SiO2-based, and SiN-based materials. Additionally, it has a proven track record in various applications, including substrate cleaning primarily using Ar gas and surface modification with O2 gas. Depending on the type and purpose of the substrate, it can be equipped not only with standard parallel plate high-frequency plasma but also with a DC discharge mechanism using pulse DC. Inline and CtoC configurations can be easily adapted to match production volumes, facilitating the transition from prototype lines to full-scale production lines.
Price information
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Applications/Examples of results
Wafer-level packaging FPD research prototype Mass production of small electronic components MEMS development and mass production Cleaning and processing of precision machine parts Cleaning and surface modification of semiconductor manufacturing equipment parts and materials
